| No. |
Part Name |
Description |
Manufacturer |
| 1 |
73K222AL |
V.22, V.21, Bell 212A, 103 Single-Chip Modem |
TDK Semiconductor |
| 2 |
73K222AL-IGT |
V.22, V.21, Bell 212A, 103 Single-Chip Modem |
TDK Semiconductor |
| 3 |
73K222AL-IH |
V.22, V.21, Bell 212A, 103 Single-Chip Modem |
TDK Semiconductor |
| 4 |
73K222AL-IP |
V.22, V.21, Bell 212A, 103 Single-Chip Modem |
TDK Semiconductor |
| 5 |
73K222BL |
V.22, V.21, Bell 212A, Bell 103 Single-Chip Modem with Integrated Hybrid |
TDK Semiconductor |
| 6 |
73K222BL |
V.22, V.21, Bell 212A, Bell 103 Single-Chip Modem with Integrated Hybrid |
TDK Semiconductor |
| 7 |
73K224L |
22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem |
TDK Semiconductor |
| 8 |
73K224L-28IH |
V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem |
TDK Semiconductor |
| 9 |
73K224L-IGT |
V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem |
TDK Semiconductor |
| 10 |
73K224L-IH |
V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem |
TDK Semiconductor |
| 11 |
73K224L-IP |
V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem |
TDK Semiconductor |
| 12 |
73K324BL |
22bis/V.22/V.21/V.23 Bell 212A Single-Chip Modem w/Integrated Hybrid |
TDK Semiconductor |
| 13 |
73K324L |
CCITT V.22bis, V.22, V.21, V.23, Bell 212A Single-Chip Modem |
TDK Semiconductor |
| 14 |
73K324L-28IH |
CCITT V.22bis, V.22, V.21, V.23, Bell 212A Single-Chip Modem |
TDK Semiconductor |
| 15 |
73K324L-IGT |
CCITT V.22bis, V.22, V.21, V.23, Bell 212A Single-Chip Modem |
TDK Semiconductor |
| 16 |
73K324L-IP |
CCITT V.22bis, V.22, V.21, V.23, Bell 212A Single-Chip Modem |
TDK Semiconductor |
| 17 |
CMX644A |
V.22 and Bell 212A Modem |
CML |
| 18 |
CMX644A |
V22 and Bell 212A Modem with DTMF Generator |
CONSUMER MICROCIRCUITS LIMITED |
| 19 |
DS_S1T2410B01 |
bipolar integrated circuit designed as a telephone bell replacement |
Samsung Electronic |
| 20 |
DS_S1T2410B02 |
bipolar integrated circuit designed as telephone bell replacement |
Samsung Electronic |
| 21 |
H66T19AA |
CMOS LSI DESIGNED FOR USE IN DOOR BELL, TELEPHONE AND TOY |
Hi-Sincerity Microelectronics |
| 22 |
H66T19BA |
CMOS LSI DESIGNED FOR USE IN DOOR BELL, TELEPHONE AND TOY |
Hi-Sincerity Microelectronics |
| 23 |
H66T32AA |
CMOS LSI DESIGNED FOR USE IN DOOR BELL, TELEPHONE AND TOY |
Hi-Sincerity Microelectronics |
| 24 |
H66T32BA |
CMOS LSI DESIGNED FOR USE IN DOOR BELL, TELEPHONE AND TOY |
Hi-Sincerity Microelectronics |
| 25 |
H66T66BA |
CMOS LSI DESIGNED FOR USE IN DOOR BELL, TELEPHONE AND TOY |
Hi-Sincerity Microelectronics |
| 26 |
H66T68AA |
CMOS LSI DESIGNED FOR USE IN DOOR BELL, TELEPHONE AND TOY |
Hi-Sincerity Microelectronics |
| 27 |
IR2157 |
Ballast Control, Below Resonance Protection, Thermal Overload Protection, Protection from Failure to Strike, Programmable Preheat Time and Run Frequency, Programmable Deadtime in a 16-pin DIP package |
International Rectifier |
| 28 |
IR21571 |
Ballast Control, Below Resonance Protection, Thermal Overload Protection, Protection from Failure to Strike, Programmable Preheat Time and Run Frequency, Programmable Deadtime, Automatic Restart for Lamp Exchange in a 16-pin DIP package |
International Rectifier |
| 29 |
IR21571S |
Ballast Control, Below Resonance Protection, Thermal Overload Protection, Protection from Failure to Strike, Programmable Preheat Time and Run Frequency, Programmable Deadtime, Automatic Restart for Lamp Exchange in a 16-lead SOIC Narrow p |
International Rectifier |
| 30 |
IR21571STR |
Ballast Control, Below Resonance Protection, Thermal Overload Protection, Protection from Failure to Strike, Programmable Preheat Time and Run Frequency, Programmable Deadtime, Automatic Restart for Lamp Exchange in a 16-lead SOIC Narrow p |
International Rectifier |
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