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Datasheets for HEAT

Datasheets found :: 408
Page: | 1 | 2 | 3 | 4 | 5 |
No. Part Name Description Manufacturer
1 2017 28 and 48W true hermetically sealed proportionally controlled metal package heater hybrid Micropac Industries
2 2032 28 and 48W true hermetically sealed proportionally controlled metal package heater hybrid Micropac Industries
3 236 Board Level Power Semiconductor Heat Sinks Wakefield Thermal Solutions
4 51974 True Hermetically Sealed Proportionally Controlled Heater Hybrids Micropac Industries
5 52228-B 50V; 40 and 50W true hermetically sealed proportionally controlled metal package heater hybrid Micropac Industries
6 52250-2 50V; 40 and 50W true hermetically sealed proportionally controlled metal package heater hybrid Micropac Industries
7 52280 True Hermetically Sealed Proportionally Controlled Metal Package Heater Hybrids Micropac Industries
8 56230 Extruded Aluminium Heatsink Philips
9 56231 Extruded Aluminium Heatsink Philips
10 56250 Diecast Heatsink for two devices Philips
11 56253 Diecast Heatsink Philips
12 56256 Diecast Heatsink Philips
13 56258 Diecast Heatsink Philips
14 56271 Diecast Heatsink Philips
15 56274 Diecast Heatsink Philips
16 56277 Diecast Heatsink Philips
17 56278 Diecast Heatsink Philips
18 56279 Diecast Heatsink Philips
19 56280 Diecast Heatsink Philips
20 56283 Diecast Heatsink Philips
21 56284 Diecast Heatsink Philips
22 56286 Diecast Heatsink Philips
23 56290 Extruded Aluminium Heatsink Philips
24 56293 Extruded Aluminium Heatsink Philips
25 56311 Water Cooled Heatsink for BTX41 series Philips
26 A80 Aluminium Heatsink type A for TO-48 case IPRS Baneasa
27 ACCESORIES Connectors and heat sinks available for use with various Burr-Brown products Burr Brown
28 ALUMINIUM-HEATSINK TYPE R Aluminium Heatsink type R IPRS Baneasa
29 ALUMINIUM-HEATSINK TYPE TNF Aluminium Heatsink type TNF IPRS Baneasa
30 AN264 RESISTANCE TO SOLDERING HEAT AND THERMAL CHARACTERISTICS OF SMDS SGS Thomson Microelectronics


Datasheets found :: 408
Page: | 1 | 2 | 3 | 4 | 5 |



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