| No. |
Part Name |
Description |
Manufacturer |
| 1 |
21-0109B |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD |
MAXIM - Dallas Semiconductor |
| 2 |
308 |
Variable Compression Mica Padders |
Arco Electronics |
| 3 |
8225 |
64-BIT bipolar scratch PAD Memory (16x4 RAM) |
Signetics |
| 4 |
AB-132 |
SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES |
Burr Brown |
| 5 |
ALMP-5075 |
Surface Mount Matching Pad |
Mini-Circuits |
| 6 |
AN1180 |
USB - USING THE ST7263 KIT TO IMPLEMENT A USB GAME PAD |
SGS Thomson Microelectronics |
| 7 |
ATN3580 Series |
Fixed Attenuator Pads |
Skyworks Solutions |
| 8 |
ATN3580-01 |
Fixed Attenuator Pads |
Skyworks Solutions |
| 9 |
ATN3580-02 |
Fixed Attenuator Pads |
Skyworks Solutions |
| 10 |
ATN3580-03 |
Chip Attenuator Pads |
Skyworks Solutions |
| 11 |
ATN3580-04 |
Chip Attenuator Pads |
Skyworks Solutions |
| 12 |
ATN3580-05 |
Chip Attenuator Pads |
Skyworks Solutions |
| 13 |
ATN3580-06 |
Chip Attenuator Pads |
Skyworks Solutions |
| 14 |
ATN3580-07 |
Chip Attenuator Pads |
Skyworks Solutions |
| 15 |
ATN3580-08 |
Chip Attenuator Pads |
Skyworks Solutions |
| 16 |
ATN3580-09 |
Chip Attenuator Pads |
Skyworks Solutions |
| 17 |
ATN3580-10 |
Chip Attenuator Pads |
Skyworks Solutions |
| 18 |
ATN3580-12 |
Chip Attenuator Pads |
Skyworks Solutions |
| 19 |
ATN3580-15 |
Chip Attenuator Pads |
Skyworks Solutions |
| 20 |
ATN3580-20 |
Chip Attenuator Pads |
Skyworks Solutions |
| 21 |
ATN3580-30 |
Chip Attenuator Pads |
Skyworks Solutions |
| 22 |
ATN3580-40 |
Chip Attenuator Pads |
Skyworks Solutions |
| 23 |
C0423 |
VARIABLE COMPRESSION MICA TRIMMERS AND PADDERS |
etc |
| 24 |
C428 |
Variable Compression MICA Trimmers and Padders |
Arco Electronics |
| 25 |
DS9096P |
iButton Adhesive Pads |
MAXIM - Dallas Semiconductor |
| 26 |
DS9096P+ |
iButton Adhesive Pads |
MAXIM - Dallas Semiconductor |
| 27 |
DS9096P/NO-BRAND |
iButton Adhesive Pads |
MAXIM - Dallas Semiconductor |
| 28 |
KS0070BM |
16com/80seg driver & controller for dot matrix LCD, mirror type pad configuration |
Samsung Electronic |
| 29 |
M24.173B |
Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP) |
Intersil |
| 30 |
MA4BPS101 |
PIN diode chip with offset bond pad |
MA-Com |
| | | |
