| No. |
Part Name |
Description |
Manufacturer |
| 1 |
EDI8833C |
+ 5V (+/-10%),32K x 8 static RAM CMOS, monolithic |
White Electronic Designs |
| 2 |
EDI8833LP |
+ 5V (+/-10%),32K x 8 static RAM CMOS, monolithic |
White Electronic Designs |
| 3 |
EDI8833P |
+ 5V (+/-10%),32K x 8 static RAM CMOS, monolithic |
White Electronic Designs |
| 4 |
EN8758 |
Power MOSFET 30V,1.8A,188m Ohm,-30V,-1.5A,325m Ohm,Complementary Dual MCPH6 |
ON Semiconductor |
| 5 |
MF0512M-11AT |
512,483,328 bytes (memory) flash ATA PC card |
Mitsubishi Electric Corporation |
| 6 |
MR18R326GAG0 |
(32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V |
Samsung Electronic |
| 7 |
MR18R326GAG0-CM8 |
(32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V |
Samsung Electronic |
| 8 |
MR18R326GAG0-CT9 |
(32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V |
Samsung Electronic |
| 9 |
MS81V10160 |
(664,320-word x 16-bit) FIFO memory |
OKI electronic components |
| 10 |
MS81V10160-12TA |
(664,320-word x 16-bit) FIFO memory |
OKI electronic components |
| 11 |
MS81V10160-15TA |
(664,320-word x 16-bit) FIFO memory |
OKI electronic components |
| 12 |
NX8563LF453-BA |
CW InGaAsP MQW DFB laser diode module for DWDM applications (10 mW min). ITU-T wavelength 1545,32 nm. Frequency 194.00 THz. FC-PC connector. Anode floating. |
NEC |
| 13 |
TIP160 |
POWER TRANSISTORS(10A,320-380V,125W) |
MOSPEC Semiconductor |
| 14 |
TIP161 |
POWER TRANSISTORS(10A,320-380V,125W) |
MOSPEC Semiconductor |
| 15 |
TIP162 |
POWER TRANSISTORS(10A,320-380V,125W) |
MOSPEC Semiconductor |
| 16 |
TOP246R-TL |
4,32A Extended power, design elexible, integrated off-line switcher |
Power Integrations Inc |
| 17 |
TSB12LV01B |
High Performance 1394 3.3V Link Layer for Telecom, Embedded & Industrial App.,32-Bit I/F, 2kb FIFO |
Texas Instruments |
| 18 |
TSB12LV01B-EP |
High Performance 1394 3.3V Link Layer for Telecom, Embedded & Industrial App.,32-Bit I/F, 2kb FIFO |
Texas Instruments |
| 19 |
TSB12LV01BIPZT |
High Performance 1394 3.3V Link Layer for Telecom, Embedded & Industrial App.,32-Bit I/F, 2kb FIFO |
Texas Instruments |
| 20 |
TSB12LV01BIPZT |
High Performance 1394 3.3V Link Layer for Telecom, Embedded & Industrial App.,32-Bit I/F, 2kb FIFO |
Texas Instruments |
| 21 |
TSB12LV01BIPZTEP |
High Performance 1394 3.3V Link Layer for Telecom, Embedded & Industrial App.,32-Bit I/F, 2kb FIFO |
Texas Instruments |
| 22 |
TSB12LV01BIPZTEP |
High Performance 1394 3.3V Link Layer for Telecom, Embedded & Industrial App.,32-Bit I/F, 2kb FIFO |
Texas Instruments |
| 23 |
TSB12LV01BPZT |
High Performance 1394 3.3V Link Layer for Telecom, Embedded & Industrial App.,32-Bit I/F, 2kb FIFO |
Texas Instruments |
| 24 |
TSB12LV01BPZT |
High Performance 1394 3.3V Link Layer for Telecom, Embedded & Industrial App.,32-Bit I/F, 2kb FIFO |
Texas Instruments |
| 25 |
TSB12LV01BPZTG4 |
High Performance 1394 3.3V Link Layer for Telecom, Embedded & Industrial App.,32-Bit I/F, 2kb FIFO 100-TQFP 0 to 70 |
Texas Instruments |
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