No. |
Part Name |
Description |
Manufacturer |
1 |
BCM1200-BTE |
Bluetooth® v1.2 Communication Software for Embedded Systems |
Broadcom |
2 |
BCM1200-BTEM |
Bluetooth® v1.2 Communication Software for Mobile Phones |
Broadcom |
3 |
HSDL-3200 |
HSDL-3200#001 · Infrared IrDA 1.2 Compliant 115.2Kb/s 3V Transceiver |
Agilent (Hewlett-Packard) |
4 |
HSDL-3201 |
HSDL-3201#001 · Infrared IrDA 1.2 Compliant 115.2Kb/s 3V Transceiver |
Agilent (Hewlett-Packard) |
5 |
HSDL-3202 |
HSDL-3202#001 · Infrared IrDA 1.2 Compliant 115.2Kb/s 3V Transceiver |
Agilent (Hewlett-Packard) |
6 |
ST890B |
1.2 CURRENT LIMITED HIGH SIDE WITH THERMAL SHUTDOWN |
ST Microelectronics |
7 |
ST890BD |
1.2 CURRENT LIMITED HIGH SIDE WITH THERMAL SHUTDOWN |
SGS Thomson Microelectronics |
8 |
ST890BD |
1.2 CURRENT LIMITED HIGH SIDE WITH THERMAL SHUTDOWN |
ST Microelectronics |
9 |
ST890BDR |
1.2 CURRENT LIMITED HIGH SIDE WITH THERMAL SHUTDOWN |
SGS Thomson Microelectronics |
10 |
ST890BDR |
1.2 CURRENT LIMITED HIGH SIDE WITH THERMAL SHUTDOWN |
ST Microelectronics |
11 |
ST890C |
1.2 CURRENT LIMITED HIGH SIDE WITH THERMAL SHUTDOWN |
ST Microelectronics |
12 |
ST890CD |
1.2 CURRENT LIMITED HIGH SIDE WITH THERMAL SHUTDOWN |
SGS Thomson Microelectronics |
13 |
ST890CD |
1.2 CURRENT LIMITED HIGH SIDE WITH THERMAL SHUTDOWN |
ST Microelectronics |
14 |
ST890CDR |
1.2 CURRENT LIMITED HIGH SIDE WITH THERMAL SHUTDOWN |
SGS Thomson Microelectronics |
15 |
ST890CDR |
1.2 CURRENT LIMITED HIGH SIDE WITH THERMAL SHUTDOWN |
ST Microelectronics |
16 |
STiC2BB |
MoCA v.2 chip set - MAC, baseband and radio integrated device |
ST Microelectronics |
17 |
STIC2BBA |
MoCA v.2 chip set - MAC, baseband and radio integrated device |
ST Microelectronics |
18 |
STIC2BBB |
MoCA v.2 chip set - MAC, baseband and radio integrated device |
ST Microelectronics |
19 |
STiC2PA |
MoCA v.2 chip set - power amplifier / low-noise amplifier |
ST Microelectronics |
20 |
STIC2PAB |
MoCA v.2 chip set - power amplifier / low-noise amplifier |
ST Microelectronics |
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