| No. |
Part Name |
Description |
Manufacturer |
| 1 |
30070-53 |
Geode GXm Processor Integrated x86 Solution with MMX Support |
National Semiconductor |
| 2 |
C67070-A2007-A70 |
IGBT Power Module (Single switch Including fast free-wheeling diodes Enlarged diode area) |
Siemens |
| 3 |
C67070-A2107-A70 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate) |
Siemens |
| 4 |
C67070-A2111-A70 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Doubled diode area) |
Siemens |
| 5 |
C67070-A2120-A67 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate) |
Siemens |
| 6 |
C67070-A2300-A70 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate) |
Siemens |
| 7 |
C67070-A2301-A70 |
IGBT Power Module (Single switch with chopper diode Package with insulated metal base plate) |
Siemens |
| 8 |
C67070-A2514-A67 |
IGBT Power Module (Power module 3-phase full-bridge Including fast free-wheel diodes Package with insulated metal base plate) |
Siemens |
| 9 |
C67070-A2515-A67 |
IGBT Power Module (Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 10 |
C67070-A2516-A67 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 11 |
C67070-A2517-A67 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 12 |
C67070-A2518-A67 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 13 |
C67070-A2519-A67 |
IGBT Power Module (Solderable Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 14 |
C67070-A2521-A67 |
IGBT Power Module (Power module 3-phase full-bridge Including fast free-wheel diodes) |
Siemens |
| 15 |
C67070-A2701-A67 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate) |
Siemens |
| 16 |
C67070-A2702-A67 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate) |
Siemens |
| 17 |
C67070-A2703-A67 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate) |
Siemens |
| 18 |
C67070-A2704-A67 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate) |
Siemens |
| 19 |
C67070-A2709-A67 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Enlarged diode area) |
Siemens |
| 20 |
C67070-A2710-A67 |
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Enlarged diode area) |
Siemens |
| 21 |
CC1070-RTR1 |
Single-Chip, Low-Power, Low-Cost CMOS FSK/GFSK/ASK/00K RF Transmitter for Narrowband & Multi-Ch Apps |
Texas Instruments |
| 22 |
CC1070-RTY1 |
Single-Chip, Low-Power, Low-Cost CMOS FSK/GFSK/ASK/00K RF Transmitter for Narrowband & Multi-Ch Apps |
Texas Instruments |
| 23 |
FCN-244F070-G/0 |
FOR BOARD-TO-BOARD CONNECTION |
Fujitsu Microelectronics |
| 24 |
FCN-244M070-G/0 |
FOR BOARD-TO-BOARD CONNECTION |
Fujitsu Microelectronics |
| 25 |
FS6070-01 |
1:4 HSTL to LVTTL fanout buffer IC |
AMI Semiconductor |
| 26 |
GC84070-00 |
Hybrid Binary Capacitors |
Microsemi |
| 27 |
LH0070-0H |
Precision 10 Volt Reference |
Linear Technology |
| 28 |
LH0070-0H |
40 V, 600 mW, precision BCD buffered reference |
National Semiconductor |
| 29 |
LH0070-1H |
Precision 10 Volt Reference |
Linear Technology |
| 30 |
LH0070-1H |
40 V, 600 mW, precision BCD buffered reference |
National Semiconductor |
| | | |
