| No. |
Part Name |
Description |
Manufacturer |
| 1 |
HLP190BS2 |
Range of Hybrid Linear Potentiometers |
etc |
| 2 |
IDT79RV5000180BS272 |
MULTI-ISSUE 64-BIT MICROPROCESSOR |
IDT |
| 3 |
IDT79RV5000180BS272I |
MULTI-ISSUE 64-BIT MICROPROCESSOR |
IDT |
| 4 |
IDT79RV5000200BS272 |
MULTI-ISSUE 64-BIT MICROPROCESSOR |
IDT |
| 5 |
IDT79RV5000200BS272I |
MULTI-ISSUE 64-BIT MICROPROCESSOR |
IDT |
| 6 |
IDT79RV5000250BS272 |
MULTI-ISSUE 64-BIT MICROPROCESSOR |
IDT |
| 7 |
IDT79RV5000250BS272I |
MULTI-ISSUE 64-BIT MICROPROCESSOR |
IDT |
| 8 |
MAX6400BS22+ |
µP Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 9 |
MAX6400BS22+T |
µP Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 10 |
MAX6400BS22-T |
2.200 V, mP supervisory circuit in 4-bump (2 x 2) chip-scale package |
MAXIM - Dallas Semiconductor |
| 11 |
MAX6400BS23 |
µP Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 12 |
MAX6400BS23-T |
2.320 V, mP supervisory circuit in 4-bump (2 x 2) chip-scale package |
MAXIM - Dallas Semiconductor |
| 13 |
MAX6400BS24-T |
2.400 V, mP supervisory circuit in 4-bump (2 x 2) chip-scale package |
MAXIM - Dallas Semiconductor |
| 14 |
MAX6400BS25-T |
2.500 V, mP supervisory circuit in 4-bump (2 x 2) chip-scale package |
MAXIM - Dallas Semiconductor |
| 15 |
MAX6400BS26 |
µP Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 16 |
MAX6400BS26-T |
2.630 V, mP supervisory circuit in 4-bump (2 x 2) chip-scale package |
MAXIM - Dallas Semiconductor |
| 17 |
MAX6400BS27-T |
2.700 V, mP supervisory circuit in 4-bump (2 x 2) chip-scale package |
MAXIM - Dallas Semiconductor |
| 18 |
MAX6400BS28-T |
2.800 V, mP supervisory circuit in 4-bump (2 x 2) chip-scale package |
MAXIM - Dallas Semiconductor |
| 19 |
MAX6400BS29 |
µP Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 20 |
MAX6400BS29+ |
µP Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 21 |
MAX6400BS29+T |
µP Supervisory Circuits in 4-Bump (2 x 2) Chip-Scale Package |
MAXIM - Dallas Semiconductor |
| 22 |
MAX6400BS29-T |
2.930 V, mP supervisory circuit in 4-bump (2 x 2) chip-scale package |
MAXIM - Dallas Semiconductor |
| 23 |
MSC2313258A-60BS2 |
1,048,576- word x 32-bit DRAM module |
OKI electronic components |
| 24 |
MSC2313258A-70BS2 |
1,048,576- word x 32-bit DRAM module |
OKI electronic components |
| 25 |
MSC2313258D-60BS2 |
1,048,576- word x 32-bit dynamic RAM module |
OKI electronic components |
| 26 |
MSC2313258D-70BS2 |
1,048,576- word x 32-bit dynamic RAM module |
OKI electronic components |
| 27 |
MSC23236C-60BS20 |
2,097,152-word x 36-bit DRAM module |
OKI electronic components |
| 28 |
MSC23236C-70BS20 |
2,097,152-word x 36-bit DRAM module |
OKI electronic components |
| 29 |
MSC23236C-80BS20 |
2,097,152-word x 36-bit DRAM module |
OKI electronic components |
| 30 |
MSC23236CL-60BS20 |
2,097,152-word x 36-bit DRAM module |
OKI electronic components |
| | | |
