| No. |
Part Name |
Description |
Manufacturer |
| 1 |
1210X104XXX |
CERAMIC MULTILAYER CAPACITORS |
NOVACAP |
| 2 |
21-0146 |
PACKAGE OUTLINE 52L TQFP, 10x10x1.0 MM |
MAXIM - Dallas Semiconductor |
| 3 |
21-0146A |
PACKAGE OUTLINE 52L TQFP, 10x10x1.0 MM |
MAXIM - Dallas Semiconductor |
| 4 |
AS-TQFP44 |
TQFP44 (10x10) socket and cover to solder to an application board for connection of ST emulators. |
ST Microelectronics |
| 5 |
HDMP-1536A |
HDMP-1536A · 1.0625 GBd Fibre Channel 10x10 mm QFP Transceiver Chip (Recommend HDMP-1636A for new designs) |
Agilent (Hewlett-Packard) |
| | | |
