| No. |
Part Name |
Description |
Manufacturer |
| 1 |
D18A |
18 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 2 |
DC18 |
18 LEAD DILMON PACKAGE |
PLESSEY Semiconductors |
| 3 |
DG18 |
18 LEAD CERAMIC DIL package |
PLESSEY Semiconductors |
| 4 |
DG18 |
18 LEAD CERAMIC DIL |
PLESSEY Semiconductors |
| 5 |
DG18 |
18 LEAD CERAMIC DIL PACKAGE |
PLESSEY Semiconductors |
| 6 |
DIPO |
DIP O - 18 lead plastic DIP - Outline drawings |
SGS-ATES |
| 7 |
DP18 |
18 LEAD PLASTIC DIL package |
PLESSEY Semiconductors |
| 8 |
DP18 |
18 LEAD PLASTIC DIL |
PLESSEY Semiconductors |
| 9 |
DP18 |
18 LEAD PLASTIC DIL PACKAGE |
PLESSEY Semiconductors |
| 10 |
DP18 |
18 LEAD PLASTIC DIL |
PLESSEY Semiconductors |
| 11 |
J18A |
18 Lead Ceramic Dual-in-Line Package |
National Semiconductor |
| 12 |
MKT-N18A |
MOLDED DIP, 18 LEAD, .300 CETER |
National Semiconductor |
| 13 |
N18A |
18 Lead (0.300 in. Wide) Molded Dual-in-Line Package |
National Semiconductor |
| | | |
