No. |
Part Name |
Description |
Manufacturer |
1 |
2N987 |
PNP Germanium VHF Diffused Transistor in TO72 metal case |
Newmarket Transistors NKT |
2 |
AF124 |
PNP Germanium VHF Diffused Transistor in TO72 metal case |
Newmarket Transistors NKT |
3 |
AF125 |
PNP Germanium VHF Diffused Transistor in TO72 metal case |
Newmarket Transistors NKT |
4 |
AF126 |
PNP Germanium VHF Diffused Transistor in TO72 metal case |
Newmarket Transistors NKT |
5 |
AF127 |
PNP Germanium VHF Diffused Transistor in TO72 metal case |
Newmarket Transistors NKT |
6 |
CLI700 |
Reflective switch, photo-IC output, 4 Lead TO-72 metal can |
Clairex Technologies |
7 |
CLI710 |
Reflective switch, phototransistor output, 4 Lead TO-72 metal can |
Clairex Technologies |
8 |
CLL130 |
Buffer w/10K pull-up Resistor, 4 Lead TO-72 metal can |
Clairex Technologies |
9 |
CLL131 |
Inverter w/10K pull-up Resistor, 4 Lead TO-72 metal can |
Clairex Technologies |
10 |
CLL133 |
Inverter, Open Collector Output, 4 Lead TO-72 metal can |
Clairex Technologies |
11 |
DFM14 |
Military, MIL-R-83401 Qualified, Type RZ, 11, 12, 15 Schematics, Hot Solder Dip, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
12 |
DFP14 |
Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
13 |
DFP16 |
Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
14 |
H03J |
3 Lead (0.100 in. Diameter P.C.) TO-52 Metal Can Package |
National Semiconductor |
15 |
H04C |
4 Lead (0.100 in. Diameter P.C.) TO-72 Metal Can Package |
National Semiconductor |
16 |
MCN |
Molded Sip, Molded Epoxy Case, Solderability per MIL-STD-202 Method 208E, Marking Resistance to Solvents per MIL-STD-202 Method 215 |
Vishay |
17 |
MCN |
Molded Sip, Molded Epoxy Case, Solderability per MIL-STD-202 Method 208E, Marking Resistance to Solvents per MIL-STD-202 Method 215 |
Vishay |
18 |
MRCN |
Molded Sip, Molded Epoxy Case, Solderability per MIL-STD-202 Method 208E, Marking Resistance to Solvents per MIL-STD-202 Method 215 |
Vishay |
19 |
MRCN |
Molded Sip, Molded Epoxy Case, Solderability per MIL-STD-202 Method 208E, Marking Resistance to Solvents per MIL-STD-202 Method 215 |
Vishay |
20 |
STKM2000 |
2m/2 POLY/2 METAL BiCMOS MIXED ANALOG-DIGITAL STANDARD CELLS |
SGS Thomson Microelectronics |
21 |
STKM2000 |
2m/2 POLY/2 METAL BiCMOS MIXED ANALOG-DIGITAL STANDARD CELLS |
ST Microelectronics |
22 |
STKM2000-SERIES |
2 m/2 POLY/2 METAL BiCMOS, MIXED ANALOG-DIGITAL STANDARD CELLS |
SGS Thomson Microelectronics |
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