| No. |
Part Name |
Description |
Manufacturer |
| 1 |
ADSP-CM402F |
ARM Cortex M4 Mixed-Signal Control Processor with Precision 16 bit ADCs in 14x14mm 120 lead LQFP |
Analog Devices |
| 2 |
ADSP-CM403F |
ARM Cortex M4 Mixed-Signal Control Processor with High Precision 16 bit ADCs in 14x14mm 120 lead LQFP |
Analog Devices |
| 3 |
D20A |
20 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 4 |
D20B |
20 Lead Ceramic Sidebrazed Dual-in-Line Package, Dual Cavity |
National Semiconductor |
| 5 |
DG20 |
20 LEAD CERAMIC DIL PACKAGE |
PLESSEY Semiconductors |
| 6 |
DP20 |
20 Lead plastic DIL package |
PLESSEY Semiconductors |
| 7 |
E20A |
20 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
| 8 |
EA20B |
20 Lead Ceramic Leadless Chip Carrier |
National Semiconductor |
| 9 |
IR1175 |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead DIP package |
International Rectifier |
| 10 |
IR1175S |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SSOP package |
International Rectifier |
| 11 |
IR1175SS |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SOIC package |
International Rectifier |
| 12 |
IR1175STR |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SSOP package |
International Rectifier |
| 13 |
IR1176 |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead DIP package |
International Rectifier |
| 14 |
IR1176S |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SSOP package |
International Rectifier |
| 15 |
IR1176SS |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SOIC package |
International Rectifier |
| 16 |
IR1176STR |
Synchronous Rectifier Driver, 2MHz Max Frequency, 500ns leadtime, Schmitt Trigger Input in a 20 Lead SSOP package |
International Rectifier |
| 17 |
IR2167 |
PFC Ballast Control, Thermal Overload Protection, Brown Out Protection, Programmable Preheat and Frequency, Programmable Deadtime in a 20 Lead DIP package |
International Rectifier |
| 18 |
IR2167S |
PFC Ballast Control, Thermal Overload Protection, Brown Out Protection, Programmable Preheat and Frequency, Programmable Deadtime in a 20 Lead SOIC package |
International Rectifier |
| 19 |
IR3220 |
Fully Protected H-Bridge for DC Motor in a 20 Lead SOIC package |
International Rectifier |
| 20 |
IR3220S |
Fully Protected H-Bridge for DC Motor in a 20 Lead SOIC package |
International Rectifier |
| 21 |
IR3220STR |
Fully Protected H-Bridge for DC Motor in a 20 Lead SOIC package |
International Rectifier |
| 22 |
J20A |
20 Lead Ceramic Dual-in-Line Package |
National Semiconductor |
| 23 |
J20AQ |
J20AQ 20 Lead Ceramic Dual-In-Line Package, EPROM |
National Semiconductor |
| 24 |
M20B |
20 Lead (0.300 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 25 |
M20D |
20 Lead (0.300 in. Wide) Molded Small Outline Package, EIAJ |
National Semiconductor |
| 26 |
MC20A |
20 Lead Ceramic Small Outline Package |
National Semiconductor |
| 27 |
MC20B |
20 Lead Ceramic Small Outline Package, EPROM |
National Semiconductor |
| 28 |
MKT-V20A |
PLASTIC CHIP CARRIER SQ 050 LD PITCH 20 LEAD |
National Semiconductor |
| 29 |
MQA20 |
20 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 30 |
MSA20 |
20 Lead Molded Shrink Small Outline Package, EIAJ, Type II |
National Semiconductor |
| | | |
