No. |
Part Name |
Description |
Manufacturer |
1 |
1N6263 EQUIV |
Silicon Schottky Barrier Diode |
Honey Technology |
2 |
82586 |
IEEE802.3 ETHERNET LAN COPROCESSOR |
Intel |
3 |
82586-10 |
IEEE802.3 ETHERNET LAN COPROCESSOR |
Intel |
4 |
82586-6 |
IEEE802.3 ETHERNET LAN COPROCESSOR |
Intel |
5 |
AIC-43C97 |
Automated, High-performance, Integrated, SCSI Protocol Controller designed for SCSI-2/SCSI-3 embedded peripheral applications |
ST Microelectronics |
6 |
AIC-43C97M/C |
Automated, High-performance, Integrated, SCSI Protocol Controller designed for SCSI-2/SCSI-3 embedded peripheral applications |
ST Microelectronics |
7 |
AN1098 |
ST10F163 EMBEDED ALGORITHM KERNAL (STEAK) FOR FLASH PROGRAMMING AND ERASING - REV0 - 29SEPT 98 |
SGS Thomson Microelectronics |
8 |
AN981 |
USB - ST92163 EMULATOR AND EPROM FOOTPRINT COMPATIBILITY GUIDELINES |
SGS Thomson Microelectronics |
9 |
AP77016-B19 |
DSP middleware (MP3 encoder) |
NEC |
10 |
BCR151L3 E6327 |
Single digital (Built-In Resistor) AF-Transistors in TSLP-3 Package |
Infineon |
11 |
C82586 |
IEEE802.3 ETHERNET LAN COPROCESSOR |
Intel |
12 |
C82586-10 |
IEEE 802.3 ethernet processor, 10MHz |
Intel |
13 |
C82586-6 |
IEEE 802.3 ethernet processor, 6MHz |
Intel |
14 |
CROSS REFERENCE |
Cross reference guide from SGS-ATES DISCRETE POWER DEVICES 3 EDITION 1977 |
SGS-ATES |
15 |
DC566A-C |
LTC6910-3 Evaluation Kit |
Linear Technology |
16 |
DC649A |
LTC3803 Evaluation Kit |
Linear Technology |
17 |
DOC-ST7-EMU3/DS |
ST7-EMU3 EMULATOR FOR ST7XXXX DEVICES |
SGS Thomson Microelectronics |
18 |
DOC-ST7-EMU3/DS |
ST7-EMU3 EMULATOR FOR ST7XXXX DEVICES |
ST Microelectronics |
19 |
DS3112 |
TEMPE T3 E3 Multiplexer, 3.3V T3/E3 Framer and M13/E13/G.747 MUX |
MAXIM - Dallas Semiconductor |
20 |
DS3112+ |
TEMPE T3 E3 Multiplexer, 3.3V T3/E3 Framer and M13/E13/G.747 MUX |
MAXIM - Dallas Semiconductor |
21 |
DS3112D1 |
TEMPE T3 E3 Multiplexer, 3.3V T3/E3 Framer and M13/E13/G.747 MUX |
MAXIM - Dallas Semiconductor |
22 |
DS3112D1+ |
TEMPE T3 E3 Multiplexer, 3.3V T3/E3 Framer and M13/E13/G.747 MUX |
MAXIM - Dallas Semiconductor |
23 |
DS3112N+ |
TEMPE T3 E3 Multiplexer, 3.3V T3/E3 Framer and M13/E13/G.747 MUX |
MAXIM - Dallas Semiconductor |
24 |
DS3112NC1 |
TEMPE T3 E3 Multiplexer, 3.3V T3/E3 Framer and M13/E13/G.747 MUX |
MAXIM - Dallas Semiconductor |
25 |
DS3112ND1E |
TEMPE T3 E3 Multiplexer, 3.3V T3/E3 Framer and M13/E13/G.747 MUX |
MAXIM - Dallas Semiconductor |
26 |
HYE25L128160AC-7.5 |
Specialty DRAMs - 128M (8Mx16) 133MHz 3-3-3 Ext. Temp |
Infineon |
27 |
HYE25L256160AC-7.5 |
Specialty DRAMs - 256M (16Mx16) 133MHz 3-3-3 Ext. Temp. |
Infineon |
28 |
HYE25L512160AC-7.5 |
Specialty DRAMs - 512M (32Mx16)133MHz 3-3-3 Ext. Temp. |
Infineon |
29 |
HYR1825640G-653 |
512 MB (256M x 18) PC600-53 ECC RIMM ... |
Infineon |
30 |
IRDC3823 |
User Guide for the IR3823 Evaluation Board |
International Rectifier |
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