| No. |
Part Name |
Description |
Manufacturer |
| 1 |
AB-030 |
THERMAL AND ELECTRICAL PROPERTIES OF SELECTED PACKAGING MATERIALS |
Burr Brown |
| 2 |
AH2001-DK50A |
For Packaging High Printers AH Series |
ROHM |
| 3 |
AH2002-DC50A |
For Packaging High Printers AH Series |
ROHM |
| 4 |
AH2004-DC50A |
For Packaging High Printers AH Series |
ROHM |
| 5 |
AH3002-DC60A |
For Packaging High Printers AH Series |
ROHM |
| 6 |
AH3004-DC50A |
For Packaging High Printers AH Series |
ROHM |
| 7 |
AH3004-DC60A |
For Packaging High Printers AH Series |
ROHM |
| 8 |
AN1227 |
IMPROVED RF MOSFET RELIABILITY THROUGH PACKAGING ENHANCEMENTS |
SGS Thomson Microelectronics |
| 9 |
AN577 |
PACKAGING AND SOLDERING METHOD DEVICES IN SMA, SMB AND SMC PACKAGE |
SGS Thomson Microelectronics |
| 10 |
AN899 |
MCUS - SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION |
SGS Thomson Microelectronics |
| 11 |
C20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 12 |
C20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 13 |
C20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 14 |
C30 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 15 |
C30 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 16 |
C30-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 17 |
CCF-07 |
Industrial, Tape and Reel Packaging, Flame Retardant Epoxy Conformal Coating, Standard 4 Band Color Code Marking |
Vishay |
| 18 |
CCF-2 |
Industrial Power, Flameproof (High Temperature Coating Meets EIA RS-325-A Spec), Small Size, High Power Rating, Excellent High Frequency Characteristics, Low Noise, Low Voltage Coefficient, Tape and Reel Packaging |
Vishay |
| 19 |
CCF-50 |
Industrial, Superior Electrical Performance, Flame Retardant Epoxy Conformal Coating, Standard 4 or 5 Band Color Code Marking, Tape and Reel Packaging |
Vishay |
| 20 |
CCF-55 |
Industrial, Superior Electrical Performance, Flame Retardant Epoxy Conformal Coating, Standard 5 Band Color Code Marking, Tape and Reel Packaging |
Vishay |
| 21 |
CCF-60 |
Industrial, Superior Electrical Performance, Flame Retardant Epoxy Conformal Coating, Standard 5 Band Color Code Marking, Tape and Reel Packaging |
Vishay |
| 22 |
CMF-55-39 |
Special Purpose, Fusible, Flameproof (Meets EIA RS-325 Spec), Special Filming and Coating Processes, Tape and Reel Packaging |
Vishay |
| 23 |
CMF-60-64 |
Special Purpose, Fusible, Flameproof (Meets EIA RS-325 Spec), Special Filming and Coating Processes, Tape and Reel Packaging |
Vishay |
| 24 |
COP8SA |
8-Bit CMOS ROM Based and One-Time Programmable OTP Microcontroller with 1k to 4k Memory/ Power On Reset/ and Very Small Packaging |
National Semiconductor |
| 25 |
COP8SAA5 |
8-Bit CMOS ROM Based and One-Time Programmable (OTP) Microcontroller with 1k to 4k Memory, Power On Reset, and Very Small Packaging |
National Semiconductor |
| 26 |
COP8SAA5 |
8-Bit CMOS ROM Microcontroller with 1k Memory, 64 RAM, Power On Reset (POR), and Very Small Packagi |
Texas Instruments |
| 27 |
COP8SAA516M7XXX |
8-Bit CMOS ROM Microcontroller with 1k Memory, 64 RAM, Power On Reset (POR), and Very Small Packaging |
National Semiconductor |
| 28 |
COP8SAA5SLB8XXX |
8-Bit CMOS ROM Microcontroller with 1k Memory, 64 RAM, Power On Reset (POR), and Very Small Packaging |
National Semiconductor |
| 29 |
COP8SAA5SLB9XXX |
8-Bit CMOS ROM Microcontroller with 1k Memory, 64 RAM, Power On Reset (POR), and Very Small Packaging |
National Semiconductor |
| 30 |
COP8SAA7 |
8-Bit CMOS OTP Microcontroller with 1k Memory, 64 RAM, Power On Reset (POR), and Very Small Packagi |
Texas Instruments |
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