| No. |
Part Name |
Description |
Manufacturer |
| 1 |
ATL60 |
The ATL60 series CMOS Gate Arrays are fabricated using a 0.6 micron drawn gate, oxide isolated, triple level metal process. Extensive cell libraries are available and support the major CAD software tools. |
Atmel |
| 2 |
RF-HDT-AJLC |
Tag-it HF-I Plus Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 3 |
RF-HDT-AJLC-G0 |
Tag-it HF-I Plus Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 4 |
RF-HDT-AJLE |
Tag-it(TM) HF-I Standard Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 5 |
RF-HDT-AJLE-G1 |
Tag-it(TM) HF-I Standard Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 6 |
RF-HDT-AJLS |
Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 7 |
RF-HDT-AJLS-G1 |
Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 8 |
RF-HDT-SJLS |
Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 9 |
RF-HDT-SJLS-G1 |
Tag-it(TM) HF-I Pro Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) |
Texas Instruments |
| 10 |
SIDC00D60SIC2(SAWN) |
Diodes - HV Chips - 600V, 2A die sawn |
Infineon |
| 11 |
SIDC00D60SIC2(SAWN) |
Diodes - HV Chips - 600V, 2A die sawn |
Infineon |
| 12 |
SIDC00D60SIC2(UNSAWN) |
Diodes - HV Chips - 600V, 2A die unsawn |
Infineon |
| 13 |
SIDC00D60SIC2(UNSAWN) |
Diodes - HV Chips - 600V, 2A die unsawn |
Infineon |
| 14 |
SIDC01D60SIC2(SAWN) |
Diodes - HV Chips - 600V, 4A die sawn |
Infineon |
| 15 |
SIDC01D60SIC2(SAWN) |
Diodes - HV Chips - 600V, 4A die sawn |
Infineon |
| 16 |
SIDC01D60SIC2(UNSAWN) |
Diodes - HV Chips - 600V, 4A die unsawn |
Infineon |
| 17 |
SIDC01D60SIC2(UNSAWN) |
Diodes - HV Chips - 600V, 4A die unsawn |
Infineon |
| 18 |
SIDC02D60SIC2(SAWN) |
Diodes - HV Chips - 600V, 6A die sawn |
Infineon |
| 19 |
SIDC02D60SIC2(SAWN) |
Diodes - HV Chips - 600V, 6A die sawn |
Infineon |
| 20 |
SIDC02D60SIC2(UNSAWN) |
Diodes - HV Chips - 600V, 6A die unsawn |
Infineon |
| 21 |
SIDC02D60SIC2(UNSAWN) |
Diodes - HV Chips - 600V, 6A die unsawn |
Infineon |
| 22 |
SIDC03D30SIC2(SAWN) |
Diodes - HV Chips - 300V, 10A die sawn |
Infineon |
| 23 |
SIDC03D30SIC2(SAWN) |
Diodes - HV Chips - 300V, 10A die sawn |
Infineon |
| 24 |
SIDC03D30SIC2(UNSAWN) |
Diodes - HV Chips - 300V, 10A die unsawn |
Infineon |
| 25 |
SIDC03D30SIC2(UNSAWN) |
Diodes - HV Chips - 300V, 10A die unsawn |
Infineon |
| 26 |
TSB12C01AWN |
High-Speed Serial-Bus Link-Layer Controller |
Texas Instruments |
| 27 |
TSB12C01AWN |
High-Speed Serial-Bus Link-Layer Controller |
Texas Instruments |
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