| No. |
Part Name |
Description |
Manufacturer |
| 1 |
DF17B-70DP-0.5V |
0.5mm Pitch Board to Board Connector |
Hirose Electric |
| 2 |
DF17B-70DS-0.5V |
0.5mm Pitch Board to Board Connector |
Hirose Electric |
| 3 |
DF18B-70DP-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 4 |
DF18B-70DS-0.4V |
0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors |
Hirose Electric |
| 5 |
HIF3HB-70DA-2.54DS |
2.54mm Pitch Board to Board Connector |
Hirose Electric |
| 6 |
HIF3HB-70DA-2.54DSA |
2.54mm Pitch Board to Board Connector |
Hirose Electric |
| 7 |
HIF3HB-70DA-2.54DSB |
2.54mm Pitch Board to Board Connector |
Hirose Electric |
| 8 |
HIF3HB-70DA-2.54DSC |
2.54mm Pitch Board to Board Connector |
Hirose Electric |
| 9 |
HIF3HB-70DB-2.54DS |
2.54mm Pitch Board to Board Connector |
Hirose Electric |
| 10 |
HIF3HB-70DB-2.54DSA |
2.54mm Pitch Board to Board Connector |
Hirose Electric |
| 11 |
HIF3HB-70DB-2.54DSB |
2.54mm Pitch Board to Board Connector |
Hirose Electric |
| 12 |
HIF3HB-70DB-2.54DSC |
2.54mm Pitch Board to Board Connector |
Hirose Electric |
| 13 |
MSC23436B-70DS10 |
4,194,304-word by 36-bit dynamicRAM module |
OKI electronic components |
| 14 |
MSC23836B-70DS20 |
8,388,608-word by 36-bit dynamic RAM module |
OKI electronic components |
| 15 |
T15M256B-70D |
32K X 8 LOW POWER CMOS STATIC RAM |
Taiwan Memory Technology |
| 16 |
T15M256B-70D |
-0.5 to 7V; 0.7W; 32 x 8 low power CMOS static RAM |
TM Technology |
| 17 |
T15M256B-70DI |
32K X 8 LOW POWER CMOS STATIC RAM |
Taiwan Memory Technology |
| 18 |
WS57C128FB-70D |
HIGH SPEED 16K x 8 CMOS EPROM |
ST Microelectronics |
| 19 |
WS57C128FB-70DM |
HIGH SPEED 16K x 8 CMOS EPROM |
ST Microelectronics |
| 20 |
WS57C128FB-70DMB |
HIGH SPEED 16K x 8 CMOS EPROM |
ST Microelectronics |
| | | |
