| No. |
Part Name |
Description |
Manufacturer |
| 1 |
ERJ3RBD1000V |
General Purpose Precision Thick Chip Resistors |
Panasonic |
| 2 |
ERJ3RBD1001V |
General Purpose Precision Thick Chip Resistors |
Panasonic |
| 3 |
ERJ3RBD1002V |
General Purpose Precision Thick Chip Resistors |
Panasonic |
| 4 |
ERJ3RBD1003V |
General Purpose Precision Thick Chip Resistors |
Panasonic |
| 5 |
ERJ6RBD1000V |
General Purpose Precision Thick Chip Resistors |
Panasonic |
| 6 |
ERJ6RBD1001V |
General Purpose Precision Thick Chip Resistors |
Panasonic |
| 7 |
ERJ6RBD1002V |
General Purpose Precision Thick Chip Resistors |
Panasonic |
| 8 |
ERJ6RBD1003V |
General Purpose Precision Thick Chip Resistors |
Panasonic |
| 9 |
HDSP-0881-BD100 |
Glass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications |
Agilent (Hewlett-Packard) |
| 10 |
HDSP-0882-BD100 |
Glass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications |
Agilent (Hewlett-Packard) |
| 11 |
HDSP-0883-BD100 |
Glass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications |
Agilent (Hewlett-Packard) |
| 12 |
HDSP-0884-BD100 |
Glass/Ceramic Numeric and Hexadecimal Displays for Industrial Applications |
Agilent (Hewlett-Packard) |
| 13 |
LPC11D14FBD100 |
32kB flash, 8kB SRAM, LQFP100 package |
NXP Semiconductors |
| 14 |
LPC11E68JBD100 |
32-bit ARM Cortex-M0+ microcontroller; up to 256 kB flash and 36 kB SRAM; 4 kB EEPROM; 12-bit ADC |
NXP Semiconductors |
| 15 |
LPC11U68JBD100 |
32-bit ARM Cortex-M0+ microcontroller; up to 256 kB flash and 36 kB SRAM; 4 kB EEPROM; USB; 12-bit ADC |
NXP Semiconductors |
| 16 |
LPC12D27FBD100 |
128kB flash, 8kB SRAM, LCD, LQFP100 package |
NXP Semiconductors |
| 17 |
LPC2157FBD100 |
Single-chip 16-bit/32-bit microcontrollers; 512 kB flash, with 32 segment x 4 LCD driver |
NXP Semiconductors |
| 18 |
LPC2158FBD100 |
Single-chip 16-bit/32-bit microcontrollers; 512 kB flash, with 32 segment x 4 LCD driver |
NXP Semiconductors |
| 19 |
LPC2361FBD100 |
Single-chip 16-bit/32-bit MCU; up to 128 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC |
NXP Semiconductors |
| 20 |
LPC2362FBD100 |
Single-chip 16-bit/32-bit MCU; up to 128 kB flash with ISP/IAP, Ethernet, USB 2.0 device/host/OTG, CAN, and 10-bit ADC/DAC |
NXP Semiconductors |
| 21 |
LPC2364FBD100 |
ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC |
NXP Semiconductors |
| 22 |
LPC2364HBD100 |
ARM7 with 128 kB flash, 34 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC |
NXP Semiconductors |
| 23 |
LPC2365FBD100 |
ARM7 with 256 kB flash, 58 kB SRAM, Ethernet and 10-bit ADC |
NXP Semiconductors |
| 24 |
LPC2366FBD100 |
ARM7 with 256 kB flash, 58 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC |
NXP Semiconductors |
| 25 |
LPC2367FBD100 |
ARM7 with 512 kB flash, 58 kB SRAM, Ethernet and 10-bit ADC |
NXP Semiconductors |
| 26 |
LPC2368FBD100 |
ARM7 with 512 kB flash, 58 kB SRAM, Ethernet, USB 2.0 Device, CAN, SD/MMC, and 10-bit ADC |
NXP Semiconductors |
| 27 |
LPC2387FBD100 |
ARM7 with 512 kB flash, 98 kB SRAM, Ethernet, USB 2.0 Device, CAN, and 10-bit ADC |
NXP Semiconductors |
| 28 |
LPC2921FBD100 |
ARM9 microcontroller with CAN, LIN, and USB |
NXP Semiconductors |
| 29 |
LPC2923FBD100 |
ARM9 microcontroller with CAN, LIN, and USB |
NXP Semiconductors |
| 30 |
LPC2925FBD100 |
ARM9 microcontroller with CAN, LIN, and USB |
NXP Semiconductors |
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