No. |
Part Name |
Description |
Manufacturer |
1 |
ERA2AEC2212X |
High Precision Thin Film Chip Resistors, High Reliability Type |
Panasonic |
2 |
ERA2APC2212X |
High Precision Thin Film Chip Resistors, High Reliability Type |
Panasonic |
3 |
ERA2ARC2212X |
High Precision Thin Film Chip Resistors, High Reliability Type |
Panasonic |
4 |
ERA3AEC2212V |
High Precision Thin Film Chip Resistors, High Reliability Type |
Panasonic |
5 |
ERA3APC2212V |
High Precision Thin Film Chip Resistors, High Reliability Type |
Panasonic |
6 |
ERA3ARC2212V |
High Precision Thin Film Chip Resistors, High Reliability Type |
Panasonic |
7 |
ERA6AEC2212V |
High Precision Thin Film Chip Resistors, High Reliability Type |
Panasonic |
8 |
ERA6APC2212V |
High Precision Thin Film Chip Resistors, High Reliability Type |
Panasonic |
9 |
ERA6ARC2212V |
High Precision Thin Film Chip Resistors, High Reliability Type |
Panasonic |
10 |
ERA8AEC2212V |
High Precision Thin Film Chip Resistors, High Reliability Type |
Panasonic |
11 |
ERA8APC2212V |
High Precision Thin Film Chip Resistors, High Reliability Type |
Panasonic |
12 |
ERA8ARC2212V |
High Precision Thin Film Chip Resistors, High Reliability Type |
Panasonic |
13 |
FDC2212 |
Noise-immune Capacitive Sensing Solution for Proximity Sensing 12-WSON -40 to 125 |
Texas Instruments |
14 |
FDC2212-Q1 |
2-channel, Noise-immune, AEC-Q100 qualified, 28-bit Capacitive Sensing Solution 12-WSON -40 to 125 |
Texas Instruments |
15 |
FDC2212DNTR |
Noise-immune Capacitive Sensing Solution for Proximity Sensing 12-WSON -40 to 125 |
Texas Instruments |
16 |
FDC2212DNTT |
Noise-immune Capacitive Sensing Solution for Proximity Sensing 12-WSON -40 to 125 |
Texas Instruments |
17 |
FDC2212QDNTRQ1 |
2-channel, Noise-immune, AEC-Q100 qualified, 28-bit Capacitive Sensing Solution 12-WSON -40 to 125 |
Texas Instruments |
18 |
FDC2212QDNTTQ1 |
2-channel, Noise-immune, AEC-Q100 qualified, 28-bit Capacitive Sensing Solution 12-WSON -40 to 125 |
Texas Instruments |
19 |
LPC2212 |
16/32-bit ARM microcontrollers; 128/256 kB ISP/IAP Flash with 10-bit ADC and external memory interface |
Philips |
20 |
LPC2212FBD144 |
Single-chip 16/32-bit ARM microcontrollers; 128/256 kB ISP/IAP flash with 10-bit ADC and external memory interface |
NXP Semiconductors |
21 |
LPC2212FBD144 |
16/32-bit ARM microcontrollers; 128/256 kB ISP/IAP Flash with 10-bit ADC and external memory interface |
Philips |
22 |
MIC2212 |
Dual µCap LDO and Power-On Reset |
Micrel Semiconductor |
23 |
MIC2212-1.85BML |
Dual uCap LDO and Power-On Reset |
Micrel Semiconductor |
24 |
MIC2212-1.8BML |
Dual uCap LDO and Power-On Reset |
Micrel Semiconductor |
25 |
MIC2212-2.6BML |
Dual uCap LDO and Power-On Reset |
Micrel Semiconductor |
26 |
MIC2212-2.7BML |
Dual uCap LDO and Power-On Reset |
Micrel Semiconductor |
27 |
MIC2212-2.85BML |
Dual uCap LDO and Power-On Reset |
Micrel Semiconductor |
28 |
MIC2212-2.8BML |
Dual uCap LDO and Power-On Reset |
Micrel Semiconductor |
29 |
MIC2212-2.9BML |
Dual uCap LDO and Power-On Reset |
Micrel Semiconductor |
30 |
MIC2212-3.0BML |
Dual uCap LDO and Power-On Reset |
Micrel Semiconductor |
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