| No. |
Part Name |
Description |
Manufacturer |
| 1 |
593D |
Solid Tantalum Chip Capacitors, Tantamount® Commercial, Low ESR, Designed for Switch Mode Power Supplies & Converters, Molded Case Available in Three Case Codes, Automatic Pick & Place Compatible, Meets EIA 53 |
Vishay |
| 2 |
893D |
Solid Tantalum Chip Capacitors, TANTAMOUNT®, Built-In-Fuse Miniature, Molded Case in Three Case Codes, Fusible, Meets EIA 535BAAC and IEC Specification QC300801/US0001, Automatic Pick and Place Compatible |
Vishay |
| 3 |
CWR11 |
Solid Tantalum Chip Capacitors, TANTAMOUNT® Solid-Electrolyte, Military, MIL-C-55365/8 Qualified, Molded Case Available in Four Case Codes, Automatic Pick and Place Compatible, Solder Plate Terminations |
Vishay |
| 4 |
MDP14 |
Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack |
Vishay |
| 5 |
MDP16 |
Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack |
Vishay |
| 6 |
MDP16-45 |
Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs |
Vishay |
| 7 |
MDP16-46 |
Dual Inline Package, Molded DIP, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Available in Tube Pack, Reduces Assembly Costs |
Vishay |
| 8 |
MDRC |
Dual Inline Package, Molded DIP, 16 Pin, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Reduces Assembly Costs |
Vishay |
| 9 |
MSP |
Single Inline Package, Molded SIP, 01, 03, 05 Schematics, 6, 8, 9, or 10 Pin 'A' Profile, 6, 8, or 10 Pin 'C' Profile, Highly Stable, Rugged, Molded Case Construction, Automatic Insert Compatible |
Vishay |
| 10 |
SOGC 01,03,05 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
| 11 |
SOGC, 45 AND 46 SCHEMATICS |
Dual Inline Package, Small Outline Molded DIP, 16 or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, Uniform Performance Characteristics |
Vishay |
| 12 |
SOMC |
Dual Inline Package, Small Outline Molded DIP, 14, 16, or 20 Pins, Rugged, Molded Case Construction, Highly Stable, Automatic Surface Mount Compatible, Reduces Assembly Costs, |
Vishay |
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