| No. |
Part Name |
Description |
Manufacturer |
| 1 |
AN609 |
Tiny IC Debounces Pushbutton Switch |
MAXIM - Dallas Semiconductor |
| 2 |
PE3 |
GaAs Foundry Services PROCESS PE3 |
Tyco Electronics |
| 3 |
RFPIC12F675F |
The rfPIC12F675 devices pack Microchip's powerful yet easy-to-program PICmicro� microcontroller architecture and a 434 MHz ASK/FSK RF transmitter into a 20-pin package. In addition, it features a 4 channel 10-bit Analog-to-Digital (A/D) co |
Microchip |
| 4 |
RFPIC12F675K |
The rfPIC12F675 devices pack Microchip's powerful yet easy-to-program PICmicro� microcontroller architecture and a 315 MHz ASK/FSK RF transmitter into a 20-pin package. In addition, it features a 4 channel 10-bit Analog-to-Digital (A/D) co |
Microchip |
| 5 |
SNA-586 |
DC-5 GNz cascadable GaAs HBT MMIC amplifier. High output IP3: 32.5 dBm at 850 MHz. Devices per reel 1000. Reel size 7 |
Stanford Microdevices |
| 6 |
SXL-208-BLK |
800-970 MHz, 50 Ohm power MMIC amplifier. High 3rd order intercept: +46dBm typ. at 900 MHz. Devices per reel 100/TRAY. |
Stanford Microdevices |
| 7 |
SXL-208-TR1 |
800-970 MHz, 50 Ohm power MMIC amplifier. High 3rd order intercept: +46dBm typ. at 900 MHz. Devices per reel 500. Reel size 7 |
Stanford Microdevices |
| 8 |
SXL-208-TR2 |
800-970 MHz, 50 Ohm power MMIC amplifier. High 3rd order intercept: +46dBm typ. at 900 MHz. Devices per reel 1000. Reel size 13 |
Stanford Microdevices |
| 9 |
SXL-316-BLK |
800-970 MHz, 50 Ohm power amplifier module. High 3rd order intercept: +52dBm typ. at 850 MHz. Devices per reel 100/TRAY. |
Stanford Microdevices |
| 10 |
SXL-316-TR2 |
800-970 MHz, 50 Ohm power amplifier module. High 3rd order intercept: +52dBm typ. at 850 MHz. Devices per reel 1000. Reel size 13 |
Stanford Microdevices |
| | | |
