| No. |
Part Name |
Description |
Manufacturer |
| 1 |
DFM14 |
Military, MIL-R-83401 Qualified, Type RZ, 11, 12, 15 Schematics, Hot Solder Dip, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 2 |
DFP14 |
Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 3 |
DFP16 |
Military, Hot Solder Dip or Gold Plated Leads, Highly Stable, Passes MIL-STD-202 Method 210, Condition E ""Resistance to Soldering Heat"" Test |
Vishay |
| 4 |
EGS/W/N |
Military/Established Reliability, MIL-R-39007 Qual., Type RWR, R Level, Meets Solvent Resistance of MIL-STD-202 (Method 215), 100% Power Stabilization and Screening Test |
Vishay |
| 5 |
ESS/W/N |
Military/Established Reliability, MIL-R-39007 Qual., Type RWR, R Level, Meets Solvent Resistance of MIL-STD-202 (Method 215), 100% Power Stabilization and Screening Test |
Vishay |
| 6 |
LCD-202G032A |
202 x 32 Dots Graphic LCD |
Vishay |
| 7 |
MCN |
Molded Sip, Molded Epoxy Case, Solderability per MIL-STD-202 Method 208E, Marking Resistance to Solvents per MIL-STD-202 Method 215 |
Vishay |
| 8 |
MCN |
Molded Sip, Molded Epoxy Case, Solderability per MIL-STD-202 Method 208E, Marking Resistance to Solvents per MIL-STD-202 Method 215 |
Vishay |
| 9 |
MRCN |
Molded Sip, Molded Epoxy Case, Solderability per MIL-STD-202 Method 208E, Marking Resistance to Solvents per MIL-STD-202 Method 215 |
Vishay |
| 10 |
MRCN |
Molded Sip, Molded Epoxy Case, Solderability per MIL-STD-202 Method 208E, Marking Resistance to Solvents per MIL-STD-202 Method 215 |
Vishay |
| 11 |
SD-202 |
Position Sensitive Diodes |
Kondenshi Corp |
| | | |
