| No. |
Part Name |
Description |
Manufacturer |
| 1 |
10 LEAD FLATPACK (FB) |
Package Outlines |
Intersil |
| 2 |
10PM |
CASE OUTLINES |
IPRS Baneasa |
| 3 |
14 LEAD CERAMIC(DD) |
PACKAGE OUTLINES |
Intersil |
| 4 |
14 LEAD CERDIP(JD) |
PACKAGE OUTLINES |
Intersil |
| 5 |
14 LEAD FLATPACK(FD-1) |
PACKAGE OUTLINES |
Intersil |
| 6 |
14 LEAD FLATPACK(FD-2) |
PACKAGE OUTLINES |
Intersil |
| 7 |
14 LEAD PLASTIC(PD) |
PACKAGE OUTLINES |
Intersil |
| 8 |
16 LEAD CERAMIC(DE) |
PACKAGE OUTLINES |
Intersil |
| 9 |
16 LEAD CERDIP (JE) |
PACKAGE OUTLINES |
Intersil |
| 10 |
16 LEAD FLATPACK (FE2) |
PACKAGE OUTLINES |
Intersil |
| 11 |
1C1202 |
CASE OUTLINES |
IPRS Baneasa |
| 12 |
1C1203 |
CASE OUTLINES |
IPRS Baneasa |
| 13 |
1G-121 |
1G121 package outline |
Transitron Electronic |
| 14 |
1PM |
CASE OUTLINES |
IPRS Baneasa |
| 15 |
20PM |
CASE OUTLINES |
IPRS Baneasa |
| 16 |
21-0076B |
PACKAGE OUTLINE, SC70, 5L |
MAXIM - Dallas Semiconductor |
| 17 |
21-0109B |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD |
MAXIM - Dallas Semiconductor |
| 18 |
21-0114 |
PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) |
MAXIM - Dallas Semiconductor |
| 19 |
21-0114B |
PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) |
MAXIM - Dallas Semiconductor |
| 20 |
21-0125A |
PACKAGE OUTLINE |
MAXIM - Dallas Semiconductor |
| 21 |
21-0136F |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm |
MAXIM - Dallas Semiconductor |
| 22 |
21-0146 |
PACKAGE OUTLINE 52L TQFP, 10x10x1.0 MM |
MAXIM - Dallas Semiconductor |
| 23 |
21-0146A |
PACKAGE OUTLINE 52L TQFP, 10x10x1.0 MM |
MAXIM - Dallas Semiconductor |
| 24 |
21-0147C |
PACKAGE OUTLINE, 6L UDFN, 1.5 X 1.0 X 0.8mm |
MAXIM - Dallas Semiconductor |
| 25 |
3PM |
CASE OUTLINES |
IPRS Baneasa |
| 26 |
40-05-015 |
Package Outline: 48 lead 300 mil SSOP |
SIMTEK |
| 27 |
40PT2 |
CASE OUTLINES |
IPRS Baneasa |
| 28 |
45PT2 |
CASE OUTLINES |
IPRS Baneasa |
| 29 |
48TQFP |
48 PIN TQFP/TQN PACKAGE OUTLINE |
SMSC Corporation |
| 30 |
4PM |
CASE OUTLINES |
IPRS Baneasa |
| | | |
