No. |
Part Name |
Description |
Manufacturer |
1 |
1N3821AUR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
2 |
1N3822AUR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
3 |
1N3823AUR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
4 |
1N3824AUR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
5 |
1N3826AUR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
6 |
1N3827AUR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
7 |
1N3828AUR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
8 |
1N4370AUR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
9 |
1N4372AUR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
10 |
1N4614UR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
11 |
1N4627UR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
12 |
1N746AUR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
13 |
1N759AUR-1 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
14 |
292D |
Solid Tantalum Chip Capacitors, TANTAMOUNT Leadless Molded |
Vishay |
15 |
ATF-331M4-BLK |
Agilent ATF-331M4 Low Noise Pseudomorphic HEMT in a Miniature Leadless Package |
Agilent (Hewlett-Packard) |
16 |
ATF-331M4-TR2 |
Agilent ATF-331M4 Low Noise Pseudomorphic HEMT in a Miniature Leadless Package |
Agilent (Hewlett-Packard) |
17 |
ATF-551M4-BLK |
Low Noise Enhancement Mode Pseudomorphic HEMT in a Miniature Leadless Package |
Agilent (Hewlett-Packard) |
18 |
ATF-551M4-TR1 |
Low Noise Enhancement Mode Pseudomorphic HEMT in a Miniature Leadless Package |
Agilent (Hewlett-Packard) |
19 |
ATF-551M4-TR2 |
Low Noise Enhancement Mode Pseudomorphic HEMT in a Miniature Leadless Package |
Agilent (Hewlett-Packard) |
20 |
ATF331M4 |
Agilent ATF-331M4 Low Noise Pseudomorphic HEMT in a Miniature Leadless Package |
Agilent (Hewlett-Packard) |
21 |
BAS 70-02L |
Leadless chip-sized package for discretes |
Infineon |
22 |
BFP460 |
ESD-Hardened RF-Bipolar NPN Transistors in Standard SOT343 and TSLP-3 (single) & TSLP-6 (dual) Leadless Packages |
Infineon |
23 |
BFR460L3 |
ESD-Hardened RF-Bipolar NPN Transistors in Standard SOT343 and TSLP-3 (single) & TSLP-6 (dual) Leadless Packages |
Infineon |
24 |
BFS460L6 |
ESD-Hardened RF-Bipolar NPN Transistors in Standard SOT343 and TSLP-3 (single) & TSLP-6 (dual) Leadless Packages |
Infineon |
25 |
BFS466L6 |
ESD-Hardened RF-Bipolar NPN Transistors in Standard SOT343 and TSLP-3 (single) & TSLP-6 (dual) Leadless Packages |
Infineon |
26 |
BFS469L6 |
ESD-Hardened RF-Bipolar NPN Transistors in Standard SOT343 and TSLP-3 (single) & TSLP-6 (dual) Leadless Packages |
Infineon |
27 |
BKCRL120 |
20 V, 1 A leadless schottky rectifier diode |
BKC International Electronics |
28 |
BKCRL130 |
30 V, 1 A leadless schottky rectifier diode |
BKC International Electronics |
29 |
BKCRL140 |
40 V, 1 A leadless schottky rectifier diode |
BKC International Electronics |
30 |
CDLL3821 |
LEADLESS PACKAGE FOR SURFACE MOUNT |
Compensated Devices Incorporated |
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