| No. |
Part Name |
Description |
Manufacturer |
| 1 |
MAX1239EEE/GH9 |
2.7V to 3.6V and 4.5V to 5.5V, Low-Power, 4-/12-Channel, 2-Wire Serial, 12-Bit ADCs |
MAXIM - Dallas Semiconductor |
| 2 |
MAX1989MEE/GG8 |
Multichannel Remote/Local Temperature Sensors |
MAXIM - Dallas Semiconductor |
| 3 |
MAX4222EEE/GG8 |
High-Speed, Single-Supply, Gain of 2, Closed-Loop, Rail-to-Rail Buffers with Enable |
MAXIM - Dallas Semiconductor |
| 4 |
MAX4222EEE/GH9 |
High-Speed, Single-Supply, Gain of 2, Closed-Loop, Rail-to-Rail Buffers with Enable |
MAXIM - Dallas Semiconductor |
| 5 |
MAX4222EEE/GH9-T |
High-Speed, Single-Supply, Gain of 2, Closed-Loop, Rail-to-Rail Buffers with Enable |
MAXIM - Dallas Semiconductor |
| 6 |
MAX4312EEE/GG8 |
High-Speed, Low-Power, Single-Supply Multichannel, Video Multiplexer-Amplifiers |
MAXIM - Dallas Semiconductor |
| 7 |
MAX4537EEE/GH9 |
Quad, Low-Voltage, SPST Analog Switches with Enable |
MAXIM - Dallas Semiconductor |
| 8 |
MAX618EEE/GG8 |
28V, PWM, Step-Up DC-DC Converter |
MAXIM - Dallas Semiconductor |
| 9 |
TLV5614IYZ |
2.7 V to 5.5V 12-Bit lead-free/green DAC in Bumped-Die (Wafer Chip Scale) Package |
Texas Instruments |
| 10 |
TLV5614IYZR |
2.7 V to 5.5V 12-Bit lead-free/green DAC in Bumped-Die (Wafer Chip Scale) Package 16-DSBGA -40 to 85 |
Texas Instruments |
| 11 |
TLV5614IYZT |
2.7 V to 5.5V 12-Bit lead-free/green DAC in Bumped-Die (Wafer Chip Scale) Package 16-DSBGA -40 to 85 |
Texas Instruments |
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