| No. |
Part Name |
Description |
Manufacturer |
| 1 |
24LC22A |
The Microchip Technology Inc. 24LC22A is a 256 x 8-bit dual-mode Electrically Erasable PROM. This device is designed for use in applications requiring storage and serial transmission of configuration and control information. Two modes of o |
Microchip |
| 2 |
AD5532ABC-1 |
32-Channel Infinite Sample-and-Hold |
Analog Devices |
| 3 |
AD5532ABC-2 |
32-Channel Infinite Sample-and-Hold |
Analog Devices |
| 4 |
AD5532ABC-3 |
32-Channel Infinite Sample-and-Hold |
Analog Devices |
| 5 |
AD5532ABC-5 |
32-Channel Infinite Sample-and-Hold |
Analog Devices |
| 6 |
AD5533 |
32-Channel Infinite Sample-and-Hold |
Analog Devices |
| 7 |
AD5533ABC-1 |
32-Channel Infinite Sample-and-Hold |
Analog Devices |
| 8 |
AD5533BBC-1 |
32-Channel Infinite Sample-and-Hold |
Analog Devices |
| 9 |
ADE7854 |
ADE7854/ADE7858/ADE7868/ADE7878: Polyphase Multifunction Energy Metering IC with Harmonic and Fundamental Information Data Sheet (Rev G, 10/2013) |
Analog Devices |
| 10 |
ADE7858 |
ADE7854/ADE7858/ADE7868/ADE7878: Polyphase Multifunction Energy Metering IC with Harmonic and Fundamental Information Data Sheet (Rev G, 10/2013) |
Analog Devices |
| 11 |
ADE7868 |
ADE7854/ADE7858/ADE7868/ADE7878: Polyphase Multifunction Energy Metering IC with Harmonic and Fundamental Information Data Sheet (Rev G, 10/2013) |
Analog Devices |
| 12 |
ADE7878 |
ADE7854/ADE7858/ADE7868/Polyphase Multifunction Energy Metering IC with Harmonic and Fundamental Information Data Sheet (Rev G, 10/2013) |
Analog Devices |
| 13 |
AN898 |
MCUS - EMC GENERAL INFORMATION |
SGS Thomson Microelectronics |
| 14 |
BL9149 |
General infrared Ray Remote Control Receiver |
etc |
| 15 |
BL9150 |
General infrared Ray Remote Control Receiver |
etc |
| 16 |
BSM200GB170DLC |
Technical Information |
Eupec GmbH |
| 17 |
C20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 18 |
C20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 19 |
C20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 20 |
C30 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 21 |
C30 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 22 |
C30-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 23 |
D10 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 24 |
D10 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 25 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 26 |
D15 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 27 |
D15 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 28 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 29 |
D20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 30 |
D20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| | | |
