No. |
Part Name |
Description |
Manufacturer |
1 |
FDM606P |
P-Channel 1.8V Logic Level Power Trench � MOSFET |
Fairchild Semiconductor |
2 |
FDM606P_NL |
P-Channel 1.8V Logic Level Power Trench MOSFET |
Fairchild Semiconductor |
3 |
MAXIM6061 |
PLASTIC ENCAPSULATED DEVICES |
MAXIM - Dallas Semiconductor |
4 |
MAXIM6062 |
PLASTIC ENCAPSULATED DEVICES |
MAXIM - Dallas Semiconductor |
5 |
MAXIM6063 |
PLASTIC ENCAPSULATED DEVICES |
MAXIM - Dallas Semiconductor |
6 |
MAXIM6064 |
PLASTIC ENCAPSULATED DEVICES |
MAXIM - Dallas Semiconductor |
7 |
MAXIM6065 |
PLASTIC ENCAPSULATED DEVICES |
MAXIM - Dallas Semiconductor |
8 |
MAXIM6066 |
PLASTIC ENCAPSULATED DEVICES |
MAXIM - Dallas Semiconductor |
9 |
MAXIM6067 |
PLASTIC ENCAPSULATED DEVICES |
MAXIM - Dallas Semiconductor |
10 |
MAXIM6068 |
PLASTIC ENCAPSULATED DEVICES |
MAXIM - Dallas Semiconductor |
11 |
NX8567SAM606-BC |
EA modulator and wavelength monitor integrated InGaAsP MQW DFB laser diode module for 2.5 Gb/s ultralong-reach 360 km DWDM applications. ITU-T wavelength 1560.606 nm. Frequency 192.10 THz. FC-UPC connector. |
NEC |
12 |
NX8567SAM606-CC |
EA modulator and wavelength monitor integrated InGaAsP MQW DFB laser diode module for 2.5 Gb/s ultralong-reach 360 km DWDM applications. ITU-T wavelength 1560.606 nm. Frequency 192.10 THz. SC-UPC connector. |
NEC |
13 |
OM6060SB |
POWER MOSFETS IN A HERMETIC ISOLATED POWER BLOCK PACKAGE |
Omnirel |
14 |
OM6061SB |
POWER MOSFETS IN A HERMETIC ISOLATED POWER BLOCK PACKAGE |
Omnirel |
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