No. |
Part Name |
Description |
Manufacturer |
1 |
2017 |
28 and 48W true hermetically sealed proportionally controlled metal package heater hybrid |
Micropac Industries |
2 |
2032 |
28 and 48W true hermetically sealed proportionally controlled metal package heater hybrid |
Micropac Industries |
3 |
2N3055 |
Diffused NPN silicon LF power transistor with very good second-breakdown properties, for high-power LF power amplifiers, stabilization circuits and power switch applications |
ITT Semiconductors |
4 |
51974 |
True Hermetically Sealed Proportionally Controlled Heater Hybrids |
Micropac Industries |
5 |
52228-B |
50V; 40 and 50W true hermetically sealed proportionally controlled metal package heater hybrid |
Micropac Industries |
6 |
52250-2 |
50V; 40 and 50W true hermetically sealed proportionally controlled metal package heater hybrid |
Micropac Industries |
7 |
52280 |
True Hermetically Sealed Proportionally Controlled Metal Package Heater Hybrids |
Micropac Industries |
8 |
5962F9475401QLA |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. |
Aeroflex Circuit Technology |
9 |
5962F9475401QLC |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. |
Aeroflex Circuit Technology |
10 |
5962F9475401QLX |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. |
Aeroflex Circuit Technology |
11 |
5962F9475401QXA |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. |
Aeroflex Circuit Technology |
12 |
5962F9475401QXC |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. |
Aeroflex Circuit Technology |
13 |
5962F9475401QXX |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. |
Aeroflex Circuit Technology |
14 |
5962F9475401QYA |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder. |
Aeroflex Circuit Technology |
15 |
5962F9475401QYC |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold. |
Aeroflex Circuit Technology |
16 |
5962F9475401QYX |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional. |
Aeroflex Circuit Technology |
17 |
5962F9475401VLA |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. |
Aeroflex Circuit Technology |
18 |
5962F9475401VLC |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. |
Aeroflex Circuit Technology |
19 |
5962F9475401VLX |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. |
Aeroflex Circuit Technology |
20 |
5962F9475401VXA |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. |
Aeroflex Circuit Technology |
21 |
5962F9475401VXC |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. |
Aeroflex Circuit Technology |
22 |
5962F9475401VXX |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. |
Aeroflex Circuit Technology |
23 |
5962F9475401VYA |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder. |
Aeroflex Circuit Technology |
24 |
5962F9475401VYC |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold. |
Aeroflex Circuit Technology |
25 |
5962F9475401VYX |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional. |
Aeroflex Circuit Technology |
26 |
5962F9475402QLA |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder. |
Aeroflex Circuit Technology |
27 |
5962F9475402QLC |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold. |
Aeroflex Circuit Technology |
28 |
5962F9475402QLX |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional. |
Aeroflex Circuit Technology |
29 |
5962F9475402QXA |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder. |
Aeroflex Circuit Technology |
30 |
5962F9475402QXC |
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold. |
Aeroflex Circuit Technology |
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