| No. |
Part Name |
Description |
Manufacturer |
| 1 |
1-03 |
Outline dimensions package |
Motorola |
| 2 |
1-04 |
Outline dimensions package |
Motorola |
| 3 |
1-05 |
Outline dimensions package |
Motorola |
| 4 |
1-2C |
OUTLINE |
TOSHIBA |
| 5 |
1-4A |
OUTLINE |
TOSHIBA |
| 6 |
1-4B |
OUTLINE |
TOSHIBA |
| 7 |
1-5A |
OUTLINE |
TOSHIBA |
| 8 |
1-5D |
OUTLINE |
TOSHIBA |
| 9 |
1-6A |
OUTLINE |
TOSHIBA |
| 10 |
10 LEAD FLATPACK (FB) |
Package Outlines |
Intersil |
| 11 |
10PM |
CASE OUTLINES |
IPRS Baneasa |
| 12 |
11-01 |
Outline dimensions package |
Motorola |
| 13 |
14 LEAD CERAMIC(DD) |
PACKAGE OUTLINES |
Intersil |
| 14 |
14 LEAD CERDIP(JD) |
PACKAGE OUTLINES |
Intersil |
| 15 |
14 LEAD FLATPACK(FD-1) |
PACKAGE OUTLINES |
Intersil |
| 16 |
14 LEAD FLATPACK(FD-2) |
PACKAGE OUTLINES |
Intersil |
| 17 |
14 LEAD PLASTIC(PD) |
PACKAGE OUTLINES |
Intersil |
| 18 |
1401 |
Bulk Metal Foil Technology, 3 Pin Transistor Outline Hermetic Resistor Network |
Vishay |
| 19 |
1403 |
Bulk Metal Foil Technology, 4 Pin Transistor Outline Hermetic Resistor Network, Smallest Available Miniature Hermetically-Sealed Network |
Vishay |
| 20 |
1413 |
Bulk Metal Foil Technology, 8 Pin Transistor Outline Hermetic Resistor Network, Ideal for Uncomplicated Networks |
Vishay |
| 21 |
1417 |
Bulk Metal Foil Technology, 8 Pin Transistor Outline Hermetic Resistor Network, Alternative Layout to Model 1413 |
Vishay |
| 22 |
1419 |
Bulk Metal Foil Technology, 10 Pin Transistor Outline Hermetic Resistor Network, Largest R Capacity of the Smaller TO Series |
Vishay |
| 23 |
1421 |
Bulk Metal Foil Technology, 12 Pin Transistor Outline Hermetic Resistor Network, Suitable for Ladder Networks, Ideal when Power Dissipation is a Consideration |
Vishay |
| 24 |
1422 |
Bulk Metal Foil Technology, 16 Pin Transistor Outline Hermetic Resistor Network, Suitable for Ladder Networks, Ideal when Power Dissipation is a Consideration |
Vishay |
| 25 |
152-02 |
Outline dimensions case |
Motorola |
| 26 |
16 LEAD CERAMIC(DE) |
PACKAGE OUTLINES |
Intersil |
| 27 |
16 LEAD CERDIP (JE) |
PACKAGE OUTLINES |
Intersil |
| 28 |
16 LEAD FLATPACK (FE2) |
PACKAGE OUTLINES |
Intersil |
| 29 |
197-01 |
Outline dimensions case |
Motorola |
| 30 |
1C1202 |
CASE OUTLINES |
IPRS Baneasa |
| | | |
