| No. |
Part Name |
Description |
Manufacturer |
| 10081 |
FO-85 |
FO85 Package Dimensions Mecanical Data |
Philips |
| 10082 |
FO-91 |
FO91 Package Dimensions Mecanical Data |
Philips |
| 10083 |
FO-92 |
FO92 Package Dimensions Mecanical Data |
Philips |
| 10084 |
FO-93 |
FO93 Package Dimensions Mecanical Data |
Philips |
| 10085 |
FO-96 |
FO96 Package Dimensions Mecanical Data |
Philips |
| 10086 |
FODM3011_NF098 |
4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers |
Fairchild Semiconductor |
| 10087 |
FODM3062 |
4-Pin Full Pitch Mini-Flat Package Zero-Cross Triac Driver Output Optocouplers |
Fairchild Semiconductor |
| 10088 |
FODM3082 |
4-Pin Full Pitch Mini-Flat Package Zero-Cross Triac Driver Output Optocouplers |
Fairchild Semiconductor |
| 10089 |
FODM8801 |
OptoHiTTM Series, High-Temperature Phototransistor Optocoupler in Half-Pitch Mini-Flat 4-Pin Package |
Fairchild Semiconductor |
| 10090 |
FOIL - HERMETIC RESISTOR NETWORK |
Hermetic Resistor Networks, Characteristics of Available Packages |
Vishay |
| 10091 |
FP-24 |
Flat Package FP24, informations |
Hitachi Semiconductor |
| 10092 |
FP1510SOT89 |
LOW NOISE, HIGH LINEARITY PACKAGED PHEMT |
Filtronic |
| 10093 |
FPT-208P-M06 |
LOW PROFILE QUAD FLAT PACKAGE 208 PIN PLASTIC |
Fujitsu Microelectronics |
| 10094 |
FPT-64P-M09 |
LOW PROFILE QUAD FLAT PACKAGE 64 PIN PLASTIC |
Fujitsu Microelectronics |
| 10095 |
FRJ-50 |
Industrial, Zero Ohm Jumper Resistor, Provides Low Resistance Circuit Interconnections, Color Band Marking, Flame Retardant Coating, Automatic Insertion Compatible, Tape and Reel Packaging |
Vishay |
| 10096 |
FRJ-55 |
Industrial, Zero Ohm Jumper Resistor, Provides Low Resistance Circuit Interconnections, Color Band Marking, Flame Retardant Coating, Automatic Insertion Compatible, Tape and Reel Packaging |
Vishay |
| 10097 |
FU-641SEA-1M1 |
1.55 um EA MODULATOR INTEGRATED DFB-LD MODULE (7 PIN PACKAGE WITH K CONNECTOR/ 10GB/s DIGITAL APPLICATION) |
Mitsubishi Electric Corporation |
| 10098 |
FU-641SEA-1M2 |
1.55 um EA MODULATOR INTEGRATED DFB-LD MODULE (7 PIN PACKAGE WITH K CONNECTOR/ 10GB/s DIGITAL APPLICATION) |
Mitsubishi Electric Corporation |
| 10099 |
FU-641SEA-1M3 |
1.55 um EA MODULATOR INTEGRATED DFB-LD MODULE (7 PIN PACKAGE WITH K CONNECTOR/ 10GB/s DIGITAL APPLICATION) |
Mitsubishi Electric Corporation |
| 10100 |
FU-641SEA-1M4 |
1.55 um EA MODULATOR INTEGRATED DFB-LD MODULE (7 PIN PACKAGE WITH K CONNECTOR/ 10GB/s DIGITAL APPLICATION) |
Mitsubishi Electric Corporation |
| 10101 |
FU-641SEA-1MX |
1.55 um EA MODULATOR INTEGRATED DFB-LD MODULE (7 PIN PACKAGE WITH K CONNECTOR, 10GB/s DIGITAL APPLICATION) |
Mitsubishi Electric Corporation |
| 10102 |
FU-641SEA-1MX |
1.55 um EA MODULATOR INTEGRATED DFB-LD MODULE (7 PIN PACKAGE WITH K CONNECTOR, 10GB/s DIGITAL APPLICATION) |
Mitsubishi Electric Corporation |
| 10103 |
G0 PACKAGE |
68 Pin Grid Array, Cavity Down with Flat Heat Sink |
TRW |
| 10104 |
G100 |
Marking for UPG100B part number, B08 NEC package |
NEC |
| 10105 |
G101 |
Marking for UPG101G part number, B08 NEC package |
NEC |
| 10106 |
G103 |
Marking for UPG103B part number, B08 NEC package |
NEC |
| 10107 |
G12B |
12-Lead (0.400 In. Square Pattern) TO-8 Metal Can Package |
National Semiconductor |
| 10108 |
G150SPBK06P3 |
150A, 600V IGBT with FWD Full Bridge configuration in a Hi-Rel INT-A-Pak 3 package |
International Rectifier |
| 10109 |
G300HHCK12P2 |
300A, 1200V IGBT with FWD half bridge configuration in a Hi-Rel INT-A-Pak 2 package |
International Rectifier |
| 10110 |
G3VM-351G |
Slim, 2.1-mm High Relay Incorporating a MOS FET Optically Coupled with an Infrared LED in a Miniature, Flat SOP Package |
OMRON Electronics |
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