| No. |
Part Name |
Description |
Manufacturer |
| 10231 |
D10 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 10232 |
D10 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 10233 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 10234 |
D123AL |
SPST 6-Channel JFET Switch Driver, Military 14-pin Flat Package |
Intersil |
| 10235 |
D123BL |
SPST 6-Channel JFET Switch Driver, Industrial 14-pin Flat Package |
Intersil |
| 10236 |
D125AL |
SPST 6-Channel JFET Switch Driver, Military 14-pin Flat Package |
Intersil |
| 10237 |
D125BL |
SPST 6-Channel JFET Switch Driver, Industrial 14-pin Flat Package |
Intersil |
| 10238 |
D14A |
14-Lead Ceramic Package |
Analog Devices |
| 10239 |
D14B |
14-Lead Ceramic DIP Package |
Analog Devices |
| 10240 |
D14D |
14 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 10241 |
D14E |
14-Lead Hermetic Dual-In-Line Package |
National Semiconductor |
| 10242 |
D15 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 10243 |
D15 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 10244 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 10245 |
D16A |
16-Pin Ceramic DIP Package |
Analog Devices |
| 10246 |
D16B |
16-Pin Ceramic DIP Package |
Analog Devices |
| 10247 |
D16C |
16 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 10248 |
D16D |
16-Lead Hybrid Metal Can Dual-In-Line Package |
National Semiconductor |
| 10249 |
D18A |
18-Pin Ceramic DIP Package |
Analog Devices |
| 10250 |
D18A |
18 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 10251 |
D18B |
18-Pin Ceramic DIP Package |
Analog Devices |
| 10252 |
D20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 10253 |
D20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 10254 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 10255 |
D20A |
20-Pin Ceramic DIP Package |
Analog Devices |
| 10256 |
D20A |
20 Lead Ceramic Sidebrazed Dual-in-Line Package |
National Semiconductor |
| 10257 |
D20B |
20-Pin Ceramic DIP Package |
Analog Devices |
| 10258 |
D20B |
20 Lead Ceramic Sidebrazed Dual-in-Line Package, Dual Cavity |
National Semiconductor |
| 10259 |
D22 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 10260 |
D22 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
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