| No. |
Part Name |
Description |
Manufacturer |
| 1141 |
20SVPK470M |
Conductive Polymer Aluminum Solid Capacitors (OS-CON) SVPK |
Panasonic |
| 1142 |
20SVPK680M |
Conductive Polymer Aluminum Solid Capacitors (OS-CON) SVPK |
Panasonic |
| 1143 |
20SVPK68M |
Conductive Polymer Aluminum Solid Capacitors (OS-CON) SVPK |
Panasonic |
| 1144 |
20SVPS22M |
Conductive Polymer Aluminum Solid Capacitors (OS-CON) SVPS |
Panasonic |
| 1145 |
20SVPS47M |
Conductive Polymer Aluminum Solid Capacitors (OS-CON) SVPS |
Panasonic |
| 1146 |
20SVQP22M |
Conductive Polymer Aluminum Solid Capacitors (OS-CON) SVQP |
Panasonic |
| 1147 |
20SVQP47M |
Conductive Polymer Aluminum Solid Capacitors (OS-CON) SVQP |
Panasonic |
| 1148 |
20TQC100MD2 |
Conductive Polymer Tantalum Solid Capacitors (POSCAP) TQC |
Panasonic |
| 1149 |
20TQC100MYF |
Conductive Polymer Tantalum Solid Capacitors (POSCAP) TQC |
Panasonic |
| 1150 |
20TQC22MYFB |
Conductive Polymer Tantalum Solid Capacitors (POSCAP) TQC |
Panasonic |
| 1151 |
20TQC33MYFD |
Conductive Polymer Tantalum Solid Capacitors (POSCAP) TQC |
Panasonic |
| 1152 |
20TQC47MYF |
Conductive Polymer Tantalum Solid Capacitors (POSCAP) TQC |
Panasonic |
| 1153 |
20TQC47MYFT |
Conductive Polymer Tantalum Solid Capacitors (POSCAP) TQC |
Panasonic |
| 1154 |
20TQC8R2M |
Conductive Polymer Tantalum Solid Capacitors (POSCAP) TQC |
Panasonic |
| 1155 |
21 ZSIP-SH |
Package Dimensions |
Samsung Electronic |
| 1156 |
21-0076B |
PACKAGE OUTLINE, SC70, 5L |
MAXIM - Dallas Semiconductor |
| 1157 |
21-0109B |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD |
MAXIM - Dallas Semiconductor |
| 1158 |
21-0114 |
PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) |
MAXIM - Dallas Semiconductor |
| 1159 |
21-0114B |
PACKAGE OUTLINE, 6 LEAD THIN SOT23, (LOW PROFILE) |
MAXIM - Dallas Semiconductor |
| 1160 |
21-0117G |
PACKAGEOUTLINE/2x2UCSP |
MAXIM - Dallas Semiconductor |
| 1161 |
21-0125A |
PACKAGE OUTLINE |
MAXIM - Dallas Semiconductor |
| 1162 |
21-0136F |
PACKAGE OUTLINE 12,16L THIN QFN, 3x3x0.8mm |
MAXIM - Dallas Semiconductor |
| 1163 |
21-0139A |
PACKAGEOUTLINE |
MAXIM - Dallas Semiconductor |
| 1164 |
21-0144B |
PACKAGEOUTLINE |
MAXIM - Dallas Semiconductor |
| 1165 |
21-0146 |
PACKAGE OUTLINE 52L TQFP, 10x10x1.0 MM |
MAXIM - Dallas Semiconductor |
| 1166 |
21-0146A |
PACKAGE OUTLINE 52L TQFP, 10x10x1.0 MM |
MAXIM - Dallas Semiconductor |
| 1167 |
21-0147C |
PACKAGE OUTLINE, 6L UDFN, 1.5 X 1.0 X 0.8mm |
MAXIM - Dallas Semiconductor |
| 1168 |
22SC5405 |
Silicon NPN triple diffusion planar type |
Panasonic |
| 1169 |
230 PCD TO-99 (TZ) |
Package Shape and dimensions |
Intersil |
| 1170 |
230F |
PACKAGE SHAPE AND DIMENSIONS |
TRW |
| | | |
