No. |
Part Name |
Description |
Manufacturer |
121 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
122 |
D22 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
123 |
D22 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
124 |
D22-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
125 |
DC-24C |
SIZE-BRAZED DIP DC24C Packaging Information |
Hitachi Semiconductor |
126 |
DC-28B |
SIZE-BRAZED DIP DC28B Packaging Information |
Hitachi Semiconductor |
127 |
DG-16 |
DG16 CERDIP Packaging Information |
Hitachi Semiconductor |
128 |
DG-16A |
DG16A CERDIP Packaging Information |
Hitachi Semiconductor |
129 |
DG-16B |
DG16B CERDIP Packaging Information |
Hitachi Semiconductor |
130 |
DG-18 |
DG18 CERDIP Packaging Information |
Hitachi Semiconductor |
131 |
DG-20 |
DG20 CERDIP Packaging Information |
Hitachi Semiconductor |
132 |
DG-24 |
DG24 CERDIP Packaging Information |
Hitachi Semiconductor |
133 |
DG-24A |
DG24A CERDIP Packaging Information |
Hitachi Semiconductor |
134 |
DG-24B |
DG24B CERDIP Packaging Information |
Hitachi Semiconductor |
135 |
DG-28 |
DG28 Packaging Information |
Hitachi Semiconductor |
136 |
DP-16 |
DUAL-IN-LINE Plastic DP16 Packaging information |
Hitachi Semiconductor |
137 |
DP-18 |
DUAL-IN-LINE Plastic DP18 Packaging information |
Hitachi Semiconductor |
138 |
DP-20 |
DUAL-IN-LINE Plastic DP20 Packaging information |
Hitachi Semiconductor |
139 |
DP-24 |
DUAL-IN-LINE Plastic DP24 Packaging information |
Hitachi Semiconductor |
140 |
DP-28 |
DUAL-IN-LINE Plastic DP28 Packaging information |
Hitachi Semiconductor |
141 |
FRJ-50 |
Industrial, Zero Ohm Jumper Resistor, Provides Low Resistance Circuit Interconnections, Color Band Marking, Flame Retardant Coating, Automatic Insertion Compatible, Tape and Reel Packaging |
Vishay |
142 |
FRJ-55 |
Industrial, Zero Ohm Jumper Resistor, Provides Low Resistance Circuit Interconnections, Color Band Marking, Flame Retardant Coating, Automatic Insertion Compatible, Tape and Reel Packaging |
Vishay |
143 |
HHBA-5101CP |
HHBA-5101CP · 1 Gb 64-bit, 33MHz Tachyon TL PCI-to-Fibre Channel Adapter, Bulk Packaging |
Agilent (Hewlett-Packard) |
144 |
HHBA-5121BP |
HHBA-5121BP · 1 Gb 64-bit, 66 MHz Tachyon TS PCI-to-Fibre Channel Adapter, Bulk Packaging |
Agilent (Hewlett-Packard) |
145 |
HHBA-5218AP |
HHBA-5218AP · Low Profile, 2Gb/s, 64-bit, 66 MHz PCI-to-Fibre Channel Adapter with SFP transceiver, Bulk Packaging |
Agilent (Hewlett-Packard) |
146 |
HHBA-5219AP |
HHBA-5219AP · Low Profile, 2Gb/s, 64-bit, 66 MHz PCI-to-Fibre Channel Adapter with SFF transceiver, Bulk Packaging |
Agilent (Hewlett-Packard) |
147 |
HHBA-5220BP |
HHBA-5220BP · 2 Gb/s, 64-bit, 66 MHz, Tachyon XL2 PCI-to-Fibre Channel Adapter with SFP transceive, Bulk Packaging |
Agilent (Hewlett-Packard) |
148 |
HHBA-5221BP |
HHBA-5221BP · 2 Gb/s, 64-bit, 66 MHz, Tachyon XL2 PCI-to-Fibre Channel Adapter with SFF transceive, Bulk Packaging |
Agilent (Hewlett-Packard) |
149 |
HHBA-5418AP |
HHBA-5418AP · Low profile, 2Gb/s, 64-bit, 133 MHz, Dual Port PCI-X to Fibre Channel Adapter with S, Bulk Packaging |
Agilent (Hewlett-Packard) |
150 |
HP5-123P-1.27DS |
High-density Packaging System |
Hirose Electric |
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