No. |
Part Name |
Description |
Manufacturer |
121 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
122 |
D15 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
123 |
D15 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
124 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
125 |
D20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
126 |
D20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
127 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
128 |
D22 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
129 |
D22 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
130 |
D22-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
131 |
DC-24C |
SIZE-BRAZED DIP DC24C Packaging Information |
Hitachi Semiconductor |
132 |
DC-28B |
SIZE-BRAZED DIP DC28B Packaging Information |
Hitachi Semiconductor |
133 |
DG-16 |
DG16 CERDIP Packaging Information |
Hitachi Semiconductor |
134 |
DG-16A |
DG16A CERDIP Packaging Information |
Hitachi Semiconductor |
135 |
DG-16B |
DG16B CERDIP Packaging Information |
Hitachi Semiconductor |
136 |
DG-18 |
DG18 CERDIP Packaging Information |
Hitachi Semiconductor |
137 |
DG-20 |
DG20 CERDIP Packaging Information |
Hitachi Semiconductor |
138 |
DG-24 |
DG24 CERDIP Packaging Information |
Hitachi Semiconductor |
139 |
DG-24A |
DG24A CERDIP Packaging Information |
Hitachi Semiconductor |
140 |
DG-24B |
DG24B CERDIP Packaging Information |
Hitachi Semiconductor |
141 |
DG-28 |
DG28 Packaging Information |
Hitachi Semiconductor |
142 |
DP-16 |
DUAL-IN-LINE Plastic DP16 Packaging information |
Hitachi Semiconductor |
143 |
DP-18 |
DUAL-IN-LINE Plastic DP18 Packaging information |
Hitachi Semiconductor |
144 |
DP-20 |
DUAL-IN-LINE Plastic DP20 Packaging information |
Hitachi Semiconductor |
145 |
DP-24 |
DUAL-IN-LINE Plastic DP24 Packaging information |
Hitachi Semiconductor |
146 |
DP-28 |
DUAL-IN-LINE Plastic DP28 Packaging information |
Hitachi Semiconductor |
147 |
FRJ-50 |
Industrial, Zero Ohm Jumper Resistor, Provides Low Resistance Circuit Interconnections, Color Band Marking, Flame Retardant Coating, Automatic Insertion Compatible, Tape and Reel Packaging |
Vishay |
148 |
FRJ-55 |
Industrial, Zero Ohm Jumper Resistor, Provides Low Resistance Circuit Interconnections, Color Band Marking, Flame Retardant Coating, Automatic Insertion Compatible, Tape and Reel Packaging |
Vishay |
149 |
HHBA-5101CP |
HHBA-5101CP · 1 Gb 64-bit, 33MHz Tachyon TL PCI-to-Fibre Channel Adapter, Bulk Packaging |
Agilent (Hewlett-Packard) |
150 |
HHBA-5121BP |
HHBA-5121BP · 1 Gb 64-bit, 66 MHz Tachyon TS PCI-to-Fibre Channel Adapter, Bulk Packaging |
Agilent (Hewlett-Packard) |
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