| No. |
Part Name |
Description |
Manufacturer |
| 121 |
D20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 122 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 123 |
D22 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 124 |
D22 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 125 |
D22-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 126 |
FRJ-50 |
Industrial, Zero Ohm Jumper Resistor, Provides Low Resistance Circuit Interconnections, Color Band Marking, Flame Retardant Coating, Automatic Insertion Compatible, Tape and Reel Packaging |
Vishay |
| 127 |
FRJ-55 |
Industrial, Zero Ohm Jumper Resistor, Provides Low Resistance Circuit Interconnections, Color Band Marking, Flame Retardant Coating, Automatic Insertion Compatible, Tape and Reel Packaging |
Vishay |
| 128 |
HHBA-5101CP |
HHBA-5101CP · 1 Gb 64-bit, 33MHz Tachyon TL PCI-to-Fibre Channel Adapter, Bulk Packaging |
Agilent (Hewlett-Packard) |
| 129 |
HHBA-5121BP |
HHBA-5121BP · 1 Gb 64-bit, 66 MHz Tachyon TS PCI-to-Fibre Channel Adapter, Bulk Packaging |
Agilent (Hewlett-Packard) |
| 130 |
HHBA-5218AP |
HHBA-5218AP · Low Profile, 2Gb/s, 64-bit, 66 MHz PCI-to-Fibre Channel Adapter with SFP transceiver, Bulk Packaging |
Agilent (Hewlett-Packard) |
| 131 |
HHBA-5219AP |
HHBA-5219AP · Low Profile, 2Gb/s, 64-bit, 66 MHz PCI-to-Fibre Channel Adapter with SFF transceiver, Bulk Packaging |
Agilent (Hewlett-Packard) |
| 132 |
HHBA-5220BP |
HHBA-5220BP · 2 Gb/s, 64-bit, 66 MHz, Tachyon XL2 PCI-to-Fibre Channel Adapter with SFP transceive, Bulk Packaging |
Agilent (Hewlett-Packard) |
| 133 |
HHBA-5221BP |
HHBA-5221BP · 2 Gb/s, 64-bit, 66 MHz, Tachyon XL2 PCI-to-Fibre Channel Adapter with SFF transceive, Bulk Packaging |
Agilent (Hewlett-Packard) |
| 134 |
HHBA-5418AP |
HHBA-5418AP · Low profile, 2Gb/s, 64-bit, 133 MHz, Dual Port PCI-X to Fibre Channel Adapter with S, Bulk Packaging |
Agilent (Hewlett-Packard) |
| 135 |
HP5-123P-1.27DS |
High-density Packaging System |
Hirose Electric |
| 136 |
HP5-123S-1.27DS |
High-density Packaging System |
Hirose Electric |
| 137 |
HP5-123S-1.27W |
High-density Packaging System |
Hirose Electric |
| 138 |
HP5-189P-1.27W |
High-density Packaging System |
Hirose Electric |
| 139 |
HP5-189PB-1.27W |
High-density Packaging System |
Hirose Electric |
| 140 |
HP5-189S-1.27DS |
High-density Packaging System |
Hirose Electric |
| 141 |
HP5-75P-1.27DS |
High-density Packaging System |
Hirose Electric |
| 142 |
HP5-75P-1.27W |
High-density Packaging System |
Hirose Electric |
| 143 |
HP5-75S-1.27DS |
High-density Packaging System |
Hirose Electric |
| 144 |
HP6-189S-1.27DS |
High-density Packaging System |
Hirose Electric |
| 145 |
IRF6621 |
The IRF6621 combines the latest HEXFET Power MOSFET Silicon technology with the advanced DirectFET packaging to achieve the lowest on-state resistance |
International Rectifier |
| 146 |
M14256 |
Memory Micromodules General Information for D1/ D2 and C Packaging |
ST Microelectronics |
| 147 |
M14C16 |
Memory Micromodules General Information for D1/ D2 and C Packaging |
ST Microelectronics |
| 148 |
M14C64 |
Memory Micromodules General Information for D1/ D2 and C Packaging |
ST Microelectronics |
| 149 |
MC500 MC400 SERIES |
MTTL I Integrated Circuits, functions and characteristics, logic diagram, packaging, cross reference |
Motorola |
| 150 |
MDTL MC930 MC830 SERIES |
General Information, functions and characteristics, packaging, truth tables, etc. |
Motorola |
| | | |
