No. |
Part Name |
Description |
Manufacturer |
12481 |
C1608C0G1H271J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12482 |
C1608C0G1H330J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12483 |
C1608C0G1H331J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12484 |
C1608C0G1H390J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12485 |
C1608C0G1H391J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12486 |
C1608C0G1H470J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12487 |
C1608C0G1H471J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12488 |
C1608C0G1H560J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12489 |
C1608C0G1H561J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12490 |
C1608C0G1H680J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12491 |
C1608C0G1H681J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12492 |
C1608C0G1H820J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12493 |
C1608C0G1H821J |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12494 |
C1608C0G1HR75C |
Ceramic Capacitors For General Use SMD |
TDK Semiconductor |
12495 |
C1658 |
Approved for use with Conexant ADSL Chip Set Meets requirements of IEC950 for supplementary insulation, 250V working voltage |
CoEv Inc |
12496 |
C1658 |
Approved for use with Conexant ADSL Chip Set Meets requirements of IEC950 for supplementary insulation, 250V working voltage |
CoEv Inc |
12497 |
C1663B |
Marking for UPC1663B part number, BF08 NEC package |
NEC |
12498 |
C1663C |
Marking for UPC1663C part number, C08 NEC package |
NEC |
12499 |
C1665 |
Marking for UPC1665 part number, C08 NEC package |
NEC |
12500 |
C1668C |
Marking for UPC1668C part number, C08 NEC package |
NEC |
12501 |
C1669C |
Marking for UPC1669C part number, C08 NEC package |
NEC |
12502 |
C1670C |
Marking for UPC1670C part number, C08 NEC package |
NEC |
12503 |
C1676 |
Approved for use with GlobeSpan HDSL2 Chip Set Meets the requirements of IEC60950 for supplementary insulation, 250V working voltage |
CoEv Inc |
12504 |
C1676 |
Approved for use with GlobeSpan HDSL2 Chip Set Meets the requirements of IEC60950 for supplementary insulation, 250V working voltage |
CoEv Inc |
12505 |
C1684B |
Marking for UPC1684B part number, BF08 NEC package |
NEC |
12506 |
C1685B |
Marking for UPC1685B part number, BF08 NEC package |
NEC |
12507 |
C1686 |
Marking for UPC1686 part number, C08 NEC package |
NEC |
12508 |
C1686B |
Marking for UPC1686B part number, BF08 NEC package |
NEC |
12509 |
C1687 |
Marking for UPC1687 part number, C08 NEC package |
NEC |
12510 |
C1687B |
Marking for UPC1687B part number, BF08 NEC package |
NEC |
| | | |