| No. |
Part Name |
Description |
Manufacturer |
| 1321 |
UPD64084 |
THREE-DIMENSIONAL Y/C SEPARATION LSI WITH ON-CHIP MEMORY |
NEC |
| 1322 |
UPD64084GC-8EA-A |
THREE-DIMENSIONAL Y/C SEPARATION LSI WITH ON-CHIP MEMORY |
NEC |
| 1323 |
UPD64084GC-8EA-Y |
THREE-DIMENSIONAL Y/C SEPARATION LSI WITH ON-CHIP MEMORY |
NEC |
| 1324 |
VQFP48 |
Case shape and dimensions |
ROHM |
| 1325 |
W14B |
NS Package, physical dimensions |
National Semiconductor |
| 1326 |
X-103 |
Shape and dimensions D.A.T.A. package |
SESCOSEM |
| 1327 |
X-29b |
Shape and dimensions D.A.T.A. package |
SESCOSEM |
| 1328 |
X-55 |
Shape and dimensions D.A.T.A. package |
SESCOSEM |
| 1329 |
X-55a |
Shape and dimensions D.A.T.A. package |
SESCOSEM |
| 1330 |
X-75 |
Shape and dimensions D.A.T.A. package |
SESCOSEM |
| 1331 |
X76 |
Case, shape and dimensions |
IPRS Baneasa |
| 1332 |
ZIP12 |
Case shape and dimensions |
ROHM |
| 1333 |
ZIP16 |
Case shape and dimensions |
ROHM |
| 1334 |
ZIP18 |
Case shape and dimensions |
ROHM |
| 1335 |
ZIP9 |
Case shape and dimensions |
ROHM |
| | | |
