| No. |
Part Name |
Description |
Manufacturer |
| 151 |
CQX15 |
GaAs INFRARED EMITTING DIODE |
Fairchild Semiconductor |
| 152 |
CQX15 |
GAAS INFRARED EMITTING DIODE |
QT Optoelectronics |
| 153 |
CQX16 |
GaAs INFRARED EMITTING DIODE |
Fairchild Semiconductor |
| 154 |
CQX16 |
GAAS INFRARED EMITTING DIODE |
QT Optoelectronics |
| 155 |
CQX17 |
GaAs INFRARED EMITTING DIODE |
Fairchild Semiconductor |
| 156 |
CQX17 |
GAAS INFRARED EMITTING DIODE |
QT Optoelectronics |
| 157 |
CQX48 |
GaAs Infrared Emitting Diode in Side View Package |
Vishay |
| 158 |
CQY10 |
Gallium arsenide luminiscence diode, infrared source for high modulation frequencies. The spectral emission is in range of the spectral sensitivity of silicon photoelektronic devices |
AEG-TELEFUNKEN |
| 159 |
CQY11B |
GaAs infrared LED |
mble |
| 160 |
CQY36N |
GaAs Infrared Emitting Diode in Miniature (T-¾) Package |
Vishay |
| 161 |
CQY37N |
GaAs Infrared Emitting Diode in Miniature (T-¾) Package |
Vishay |
| 162 |
CS8130 |
Crystal Multi-Standard Infrared Transceiver |
Cirrus Logic |
| 163 |
CS8130-CS |
Multi-standard infrared transceiver |
Cirrus Logic |
| 164 |
CS8130-CS |
Multi-Standard Infrared Transceiver |
Crystal Semiconductor Corporation |
| 165 |
CSL-372 |
SPECIFICATION OF PYROELECTRIC PASSIVE INFRARED SENSOR |
etc |
| 166 |
CURRENT |
Photocoupler - Supplementary Information |
TOSHIBA |
| 167 |
D10 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 168 |
D10 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 169 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 170 |
D15 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 171 |
D15 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 172 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 173 |
D20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 174 |
D20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 175 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 176 |
D22 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
| 177 |
D22 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 178 |
D22-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
| 179 |
DC-24C |
SIZE-BRAZED DIP DC24C Packaging Information |
Hitachi Semiconductor |
| 180 |
DC-28B |
SIZE-BRAZED DIP DC28B Packaging Information |
Hitachi Semiconductor |
| | | |
