| No. |
Part Name |
Description |
Manufacturer |
| 151 |
HHBA-5219AP |
HHBA-5219AP · Low Profile, 2Gb/s, 64-bit, 66 MHz PCI-to-Fibre Channel Adapter with SFF transceiver, Bulk Packaging |
Agilent (Hewlett-Packard) |
| 152 |
HHBA-5220BP |
HHBA-5220BP · 2 Gb/s, 64-bit, 66 MHz, Tachyon XL2 PCI-to-Fibre Channel Adapter with SFP transceive, Bulk Packaging |
Agilent (Hewlett-Packard) |
| 153 |
HHBA-5221BP |
HHBA-5221BP · 2 Gb/s, 64-bit, 66 MHz, Tachyon XL2 PCI-to-Fibre Channel Adapter with SFF transceive, Bulk Packaging |
Agilent (Hewlett-Packard) |
| 154 |
HHBA-5418AP |
HHBA-5418AP · Low profile, 2Gb/s, 64-bit, 133 MHz, Dual Port PCI-X to Fibre Channel Adapter with S, Bulk Packaging |
Agilent (Hewlett-Packard) |
| 155 |
HP5-123P-1.27DS |
High-density Packaging System |
Hirose Electric |
| 156 |
HP5-123S-1.27DS |
High-density Packaging System |
Hirose Electric |
| 157 |
HP5-123S-1.27W |
High-density Packaging System |
Hirose Electric |
| 158 |
HP5-189P-1.27W |
High-density Packaging System |
Hirose Electric |
| 159 |
HP5-189PB-1.27W |
High-density Packaging System |
Hirose Electric |
| 160 |
HP5-189S-1.27DS |
High-density Packaging System |
Hirose Electric |
| 161 |
HP5-75P-1.27DS |
High-density Packaging System |
Hirose Electric |
| 162 |
HP5-75P-1.27W |
High-density Packaging System |
Hirose Electric |
| 163 |
HP5-75S-1.27DS |
High-density Packaging System |
Hirose Electric |
| 164 |
HP6-189S-1.27DS |
High-density Packaging System |
Hirose Electric |
| 165 |
IRF6621 |
The IRF6621 combines the latest HEXFET Power MOSFET Silicon technology with the advanced DirectFET packaging to achieve the lowest on-state resistance |
International Rectifier |
| 166 |
M14256 |
Memory Micromodules General Information for D1/ D2 and C Packaging |
ST Microelectronics |
| 167 |
M14C16 |
Memory Micromodules General Information for D1/ D2 and C Packaging |
ST Microelectronics |
| 168 |
M14C64 |
Memory Micromodules General Information for D1/ D2 and C Packaging |
ST Microelectronics |
| 169 |
MC500 MC400 SERIES |
MTTL I Integrated Circuits, functions and characteristics, logic diagram, packaging, cross reference |
Motorola |
| 170 |
MDTL MC930 MC830 SERIES |
General Information, functions and characteristics, packaging, truth tables, etc. |
Motorola |
| 171 |
MDTL MCE930 SERIES |
Dielectrically isolated integrated circuits, Radiation Hardness, DIONIC Structure, Nichrome Reistors, packaging, etc. |
Motorola |
| 172 |
MECL II |
MC1000/MC1200 series, functions and characteristics, logic diagrams, general information, packaging |
Motorola |
| 173 |
MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 174 |
MKI 1810 |
Box encapsulated capacitor for surface mounting , C-values 1000 pF-10 µF, 50 - 400 VDC, Code sizes 2220, 2824, 4036, 5045, 6560, Tape and Reel packaging |
Vishay |
| 175 |
MKT 1802 |
EIA standard chip sizes, Exellent thermal shock resistance, No piezoelectric effect, Nonpolar construction, Tape and Reel packaging supplied in hermetically sealed bags, Open construction |
Vishay |
| 176 |
MKT 1804 |
Box encapsulated capacitor for surface mounting , C-values 1000 pF-10 µF, 50 - 400 VDC, Code sizes 2220, 2824, 4036, 5045, 6560, Tape and Reel packaging |
Vishay |
| 177 |
MTTL II MC2100 MC2000 SERIES |
General Information, Logic Diagram, power dissipation, cross reference, packaging |
Motorola |
| 178 |
MTTL MC5400F MC7400F SERIES |
Functions and Characteristics, general information, logic diagram summary, packaging, definitions |
Motorola |
| 179 |
MTTL MC7400P MC5400L MC7400L SERIES |
Functions and Characteristics, logic diagram summary, general information, maximul ratings, noise imunity, packaging |
Motorola |
| 180 |
NTHS |
Surface Mount Chip NTC Thermistors, Wraparound Terminations, High-Density Monolithic Ceramic Construction, Available in 8 mm Tape and Reel Packaging |
Vishay |
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