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Datasheets for AGIN

Datasheets found :: 692
Page: | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |
No. Part Name Description Manufacturer
151 COP8SAC7SLB8 8-Bit CMOS OTP Microcontroller with 4k Memory, 128 RAM, Power On Reset (POR), and Very Small Packaging National Semiconductor
152 COP8SAC7SLB8 8-Bit CMOS OTP Microcontroller with 4k Memory, 128 RAM, Power On Reset (POR), and Very Small Packaging National Semiconductor
153 COP8SAC7SLB9 8-Bit CMOS OTP Microcontroller with 4k Memory, 128 RAM, Power On Reset (POR), and Very Small Packaging National Semiconductor
154 COP8SAC7SLB9 8-Bit CMOS OTP Microcontroller with 4k Memory, 128 RAM, Power On Reset (POR), and Very Small Packaging National Semiconductor
155 CR Chip, Flow Solderable, Custom Sizes Available, Burn-in Data Available, Automatic Placement Capability, Top and Wraparound Terminations, Tape and Reel Packaging Available, Internationally Standardized Sizes Vishay
156 CRHV Chip, Flow Solderable, Custom Sizes Available, Automatic Placement Capability, Top and Wraparound Terminations, Tape and Reel Packaging Available, Internationally Standardized Sizes Vishay
157 CWR06 Solid Tantalum Chip Capacitors, Conformal, MIDGET® Solid-Electrolyte Military, MIL-C-55365/4 Qualified, Minimum Size, Tape and Reel Packaging, Gold Plate, 60/40 Electroplate, or Hot Solder Dipped Terminations Available Vishay
158 CXA3117 Achieving Low Power and High Speed in Paging System IF IC SONY
159 D10 Memory Micromodules General Information for D1, D2 and C Packaging SGS Thomson Microelectronics
160 D10 MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING ST Microelectronics
161 D10-MICROMODULES MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING SGS Thomson Microelectronics
162 D15 Memory Micromodules General Information for D1, D2 and C Packaging SGS Thomson Microelectronics
163 D15 MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING ST Microelectronics
164 D15-MICROMODULES MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING SGS Thomson Microelectronics
165 D20 Memory Micromodules General Information for D1, D2 and C Packaging SGS Thomson Microelectronics
166 D20 MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING ST Microelectronics
167 D20-MICROMODULES MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING SGS Thomson Microelectronics
168 D22 Memory Micromodules General Information for D1, D2 and C Packaging SGS Thomson Microelectronics
169 D22 MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING ST Microelectronics
170 D22-MICROMODULES MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING SGS Thomson Microelectronics
171 DESIGN SEMINAR CCD Imaging Systems Burr Brown
172 F2813-11 Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs Hamamatsu Corporation
173 F2813-11M Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs Hamamatsu Corporation
174 F2813-11P Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs Hamamatsu Corporation
175 F2813-11S Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs Hamamatsu Corporation
176 F2813-12 Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs Hamamatsu Corporation
177 F2813-12M Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs Hamamatsu Corporation
178 F2813-12P Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs Hamamatsu Corporation
179 F2813-12S Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs Hamamatsu Corporation
180 F2813-13 Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs Hamamatsu Corporation


Datasheets found :: 692
Page: | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 |



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