No. |
Part Name |
Description |
Manufacturer |
151 |
COP8SAC7SLB8 |
8-Bit CMOS OTP Microcontroller with 4k Memory, 128 RAM, Power On Reset (POR), and Very Small Packaging |
National Semiconductor |
152 |
COP8SAC7SLB8 |
8-Bit CMOS OTP Microcontroller with 4k Memory, 128 RAM, Power On Reset (POR), and Very Small Packaging |
National Semiconductor |
153 |
COP8SAC7SLB9 |
8-Bit CMOS OTP Microcontroller with 4k Memory, 128 RAM, Power On Reset (POR), and Very Small Packaging |
National Semiconductor |
154 |
COP8SAC7SLB9 |
8-Bit CMOS OTP Microcontroller with 4k Memory, 128 RAM, Power On Reset (POR), and Very Small Packaging |
National Semiconductor |
155 |
CR |
Chip, Flow Solderable, Custom Sizes Available, Burn-in Data Available, Automatic Placement Capability, Top and Wraparound Terminations, Tape and Reel Packaging Available, Internationally Standardized Sizes |
Vishay |
156 |
CRHV |
Chip, Flow Solderable, Custom Sizes Available, Automatic Placement Capability, Top and Wraparound Terminations, Tape and Reel Packaging Available, Internationally Standardized Sizes |
Vishay |
157 |
CWR06 |
Solid Tantalum Chip Capacitors, Conformal, MIDGET® Solid-Electrolyte Military, MIL-C-55365/4 Qualified, Minimum Size, Tape and Reel Packaging, Gold Plate, 60/40 Electroplate, or Hot Solder Dipped Terminations Available |
Vishay |
158 |
CXA3117 |
Achieving Low Power and High Speed in Paging System IF IC |
SONY |
159 |
D10 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
160 |
D10 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
161 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
162 |
D15 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
163 |
D15 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
164 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
165 |
D20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
166 |
D20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
167 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
168 |
D22 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
169 |
D22 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
170 |
D22-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
171 |
DESIGN SEMINAR |
CCD Imaging Systems |
Burr Brown |
172 |
F2813-11 |
Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs |
Hamamatsu Corporation |
173 |
F2813-11M |
Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs |
Hamamatsu Corporation |
174 |
F2813-11P |
Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs |
Hamamatsu Corporation |
175 |
F2813-11S |
Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs |
Hamamatsu Corporation |
176 |
F2813-12 |
Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs |
Hamamatsu Corporation |
177 |
F2813-12M |
Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs |
Hamamatsu Corporation |
178 |
F2813-12P |
Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs |
Hamamatsu Corporation |
179 |
F2813-12S |
Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs |
Hamamatsu Corporation |
180 |
F2813-13 |
Rectangular MCP and assembly series. For detection and imaging of electron, ions, VUV lights, X-rays and V-rays: mass spectroscopy, energy spectroscopy and high-speed response CRTs |
Hamamatsu Corporation |
| | | |