No. |
Part Name |
Description |
Manufacturer |
151 |
C30 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
152 |
C30 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
153 |
C30-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
154 |
C30-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
155 |
D10 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
156 |
D10 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
157 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
158 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
159 |
D15 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
160 |
D15 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
161 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
162 |
D15-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
163 |
D20 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
164 |
D20 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
165 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
166 |
D20-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
167 |
D22 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
168 |
D22 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
169 |
D22-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
170 |
D22-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
171 |
DLPA200 |
DMD Micromirror Driver |
Texas Instruments |
172 |
DLPA200PFP |
DMD Micromirror Driver 80-HTQFP |
Texas Instruments |
173 |
DS1232 |
MicroMonitor Chip |
Dallas Semiconductor |
174 |
DS1232 |
MicroMonitor Chip |
MAXIM - Dallas Semiconductor |
175 |
DS1232+ |
MicroMonitor Chip |
MAXIM - Dallas Semiconductor |
176 |
DS1232LP |
Low power micromonitor chip |
Dallas Semiconductor |
177 |
DS1232LP |
Low-Power MicroMonitor Chip |
MAXIM - Dallas Semiconductor |
178 |
DS1232LP+ |
Low-Power MicroMonitor Chip |
MAXIM - Dallas Semiconductor |
179 |
DS1232LPN |
Low-Power MicroMonitor Chip |
MAXIM - Dallas Semiconductor |
180 |
DS1232LPN+ |
Low-Power MicroMonitor Chip |
MAXIM - Dallas Semiconductor |
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