| No. |
Part Name |
Description |
Manufacturer |
| 151 |
DIPP |
DIP P - 14 lead ceramic DIP - Outline drawings |
SGS-ATES |
| 152 |
DIPQ |
DIP Q - 16 lead ceramic DIP - Outline drawings |
SGS-ATES |
| 153 |
DIPR |
DIP R - 40 lead ceramic DIP - Outline drawings |
SGS-ATES |
| 154 |
DIPS |
DIP S - 14 lead ceramic flat package - Outline drawings |
SGS-ATES |
| 155 |
DIPT |
DIP T - 28 lead ceramic DIP - Outline drawings |
SGS-ATES |
| 156 |
DIPV |
DIP V - 14 lead ceramic flat package - Outline drawings |
SGS-ATES |
| 157 |
DIPW |
DIP W - 16 lead ceramic flat package - Outline drawings |
SGS-ATES |
| 158 |
DIPX |
DIP X(1) - 24 lead ceramic DIP (with transparent lid) - Outline drawings |
SGS-ATES |
| 159 |
DIPX |
DIP X - 24 lead ceramic DIP - Outline drawings |
SGS-ATES |
| 160 |
DIPY |
DIP Y - 22 lead ceramic DIP - Outline drawings |
SGS-ATES |
| 161 |
DSP56600AD |
INTERGRATED CELLULAR BASEBAND PROCESSOR DEVELOPMENT IC |
Freescale (Motorola) |
| 162 |
DSP56600FM |
INTERGRATED CELLULAR BASEBAND PROCESSOR DEVELOPMENT IC |
Freescale (Motorola) |
| 163 |
DSP56651 |
INTERGRATED CELLULAR BASEBAND PROCESSOR DEVELOPMENT IC |
Freescale (Motorola) |
| 164 |
DSP56651D |
INTERGRATED CELLULAR BASEBAND PROCESSOR DEVELOPMENT IC |
Freescale (Motorola) |
| 165 |
DSP56651DS |
DSP56651/D Integrated Cellular Baseband Processor Development IC Revision 0 |
Motorola |
| 166 |
DSP56652DS |
DSP56652/D Integrated Cellular Baseband Processor |
Motorola |
| 167 |
DSP56652UM |
INTERGRATED CELLULAR BASEBAND PROCESSOR DEVELOPMENT IC |
Freescale (Motorola) |
| 168 |
DSP56653AD |
INTERGRATED CELLULAR BASEBAND PROCESSOR DEVELOPMENT IC |
Freescale (Motorola) |
| 169 |
E20A |
20 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
| 170 |
E24B |
24 Lead Ceramic Leadless Chip Carrier |
National Semiconductor |
| 171 |
E28A |
28 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
| 172 |
E32A |
32 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
| 173 |
E32B |
32 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
| 174 |
E32C |
32 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
| 175 |
E40A |
40 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
| 176 |
E44A |
44 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
| 177 |
E48A |
48 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
| 178 |
E68B |
68 Lead Ceramic Leadless Chip Carrier, Type B |
National Semiconductor |
| 179 |
E68C |
68 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
| 180 |
E84A |
84 Lead Ceramic Leadless Chip Carrier, Type C |
National Semiconductor |
| | | |
