No. |
Part Name |
Description |
Manufacturer |
151 |
F2224-39 |
Circular MCP and assembly series. For analytical instruments, electron tibe, cosmic measurement, high energy physics |
Hamamatsu Corporation |
152 |
F2224-39M |
Circular MCP and assembly series. For analytical instruments, electron tibe, cosmic measurement, high energy physics |
Hamamatsu Corporation |
153 |
F2224-39P |
Circular MCP and assembly series. For analytical instruments, electron tibe, cosmic measurement, high energy physics |
Hamamatsu Corporation |
154 |
F2224-39S |
Circular MCP and assembly series. For analytical instruments, electron tibe, cosmic measurement, high energy physics |
Hamamatsu Corporation |
155 |
HCS410 |
The HCS410 is a code hopping transponder device designed for secure entry systems. The HCS410 utilizes the patented KEELOQ® code hopping system and bi-directional challenge-and-response for logical and physical access control. High se |
Microchip |
156 |
HCS412 |
The HCS412 combines the patented KEELOQ® code hopping technology and bi-directional transponder challenge-and-response security into a single chip solution for logical and physical access control. High security learning mechanisms mak |
Microchip |
157 |
HCS473 |
The HCS473 combines the patented KEELOQ® code hopping technology and bi-directional transponder challenge-and-response security into a single chip solution for logical and physical access control. High security learning mechanisms mak |
Microchip |
158 |
IDT77V1254L25 |
Quad Port PHY (Physical Layer) for 25.6 and 51.2 ATM Networks |
IDT |
159 |
IDT77V1254L25L25PG |
Quad Port PHY (Physical Layer) for 25.6 and 51.2 ATM Networks |
IDT |
160 |
IDT77V1254L25L25PGI |
Quad Port PHY (Physical Layer) for 25.6 and 51.2 ATM Networks |
IDT |
161 |
J14A |
NS Package, physical dimensions |
National Semiconductor |
162 |
J16A |
NS Package, physical dimensions |
National Semiconductor |
163 |
J18A |
NS Package, physical dimensions |
National Semiconductor |
164 |
J20A |
NS Package, physical dimensions |
National Semiconductor |
165 |
J22A |
NS Package, physical dimensions |
National Semiconductor |
166 |
J24A |
NS Package, physical dimensions |
National Semiconductor |
167 |
J24F |
NS Package, physical dimensions |
National Semiconductor |
168 |
KS8721BL |
3.3V 10/100 BASE-TX/FX PHYSICAL LAYER TRANSCEIVER |
Micrel Semiconductor |
169 |
KS8721SL |
3.3V 10/100 BASE-TX/FX PHYSICAL LAYER TRANSCEIVER |
Micrel Semiconductor |
170 |
LAN83C183 |
FAST ETHERNET PHYSICAL LAYER DEVICE |
SMSC Corporation |
171 |
LAN83C185 |
HIGH PERFORMANCE SINGLE CHIP LOW POWER 10/100 ETHERNET PHYSICAL LAYER TRANSCEIVER |
SMSC Corporation |
172 |
LAN83C185-JD |
HIGH PERFORMANCE SINGLE CHIP LOW POWER 10/100 ETHERNET PHYSICAL LAYER TRANSCEIVER |
SMSC Corporation |
173 |
LY9001 |
Charger Interface Physical Layer IC |
Shenzhen StrongLink Electronics |
174 |
MC33388 |
CAN Low Speed Fault Tolerant Physical Interface |
Freescale (Motorola) |
175 |
MC33399 |
LIN: Local Interconnect Network Physical Interface |
Freescale (Motorola) |
176 |
MC33399 |
LIN: Local Interconnect Network Physical Interface |
Freescale (Motorola) |
177 |
MC33399 |
MC33399 Automotive "Local Interconnect Network" Physical Interface |
Motorola |
178 |
MC33399D |
Automotive Local Interconnect Network Physical Interface |
Motorola |
179 |
MC33661 |
LIN Enhanced Physical Interface |
Motorola |
180 |
MC33661D |
LIN Enhanced Physical Interface |
Motorola |
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