| No. |
Part Name |
Description |
Manufacturer |
| 151 |
BUK474-200A |
PowerMOS transistor Isolated version of BUK454-200A/B |
Philips |
| 152 |
BUK474-200B |
PowerMOS transistor Isolated version of BUK454-200A/B |
Philips |
| 153 |
BUK475-100A |
PowerMOS transistor Isolated version of BUK455-100A/B |
Philips |
| 154 |
BUK475-100B |
PowerMOS transistor Isolated version of BUK455-100A/B |
Philips |
| 155 |
BUK475-200A |
PowerMOS transistor Isolated version of BUK455-200A/B |
Philips |
| 156 |
BUK475-200B |
PowerMOS transistor Isolated version of BUK455-200A/B |
Philips |
| 157 |
BUK475-60A |
PowerMOS transistor Isolated version of BUK455-60A/B |
Philips |
| 158 |
BUK475-60B |
PowerMOS transistor Isolated version of BUK455-60A/B |
Philips |
| 159 |
BUK475-60H |
PowerMOS transistor Isolated version of BUK455-60H |
Philips |
| 160 |
CSL-372 |
SPECIFICATION OF PYROELECTRIC PASSIVE INFRARED SENSOR |
etc |
| 161 |
CTCSS |
Generation of Non-Standard CTCSS Tones |
CONSUMER MICROCIRCUITS LIMITED |
| 162 |
CXD1250M |
Example of Combination of Frame Readout System CCD Image Sensor and System IC |
SONY |
| 163 |
CXD1254AR |
Example of Combination of Frame Readout System CCD Image Sensor and System IC |
SONY |
| 164 |
EB38 |
Application Note - measuring the intermodulation distorsion of linear amplifiers |
Motorola |
| 165 |
EB38 |
MEASURING THE INTERMODULATION DISTORTION OF LINEAR AMPLIFIERS |
Motorola |
| 166 |
ECQV |
Designed for application where high density insertion of components is required. |
Panasonic |
| 167 |
ECQV1103JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 168 |
ECQV1104JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 169 |
ECQV1123JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 170 |
ECQV1124JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 171 |
ECQV1153JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 172 |
ECQV1154JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 173 |
ECQV1183JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 174 |
ECQV1184JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 175 |
ECQV1223JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 176 |
ECQV1224JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 177 |
ECQV1273JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 178 |
ECQV1274JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 179 |
ECQV1333JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| 180 |
ECQV1334JM |
Designed for application where high density insertion of components is required. |
Panasonic |
| | | |
