| No. |
Part Name |
Description |
Manufacturer |
| 151 |
EP05H10 |
SBD JEDEC SOD -123l |
Nihon |
| 152 |
EP10LA03 |
SBD JEDEC SOD PACKAGE |
Nihon |
| 153 |
EP10QY03 |
SBD JEDEC SOD |
Nihon |
| 154 |
H08A |
8-Pin Package TO-99 Style (JEDEC REF MO-002AB) |
Analog Devices |
| 155 |
H08B |
8-Pin Package TO-99 Style (JEDEC REF MO-006AH) |
Analog Devices |
| 156 |
JEDEC HI-REL |
Ordering & Marking for JEDEC HI-REL processing program |
Motorola |
| 157 |
JEDEC HI-REL |
Ordering & Marking for JEDEC HI-REL processing program |
Motorola |
| 158 |
JV2N7227 |
POWER MOS IV JEDEC REGISTERED N - CHANNEL HIGH VOLTAGE POWER MOSFETS 400 Volt 0.315 Ohm |
Advanced Power Technology |
| 159 |
JV2N7228 |
POWER MOS IV JEDEC REGISTERED N - CHANNEL HIGH VOLTAGE POWER MOSFETS 500 Volt 0.415 Ohm |
Advanced Power Technology |
| 160 |
JX2N7227 |
POWER MOS IV JEDEC REGISTERED N - CHANNEL HIGH VOLTAGE POWER MOSFETS 400 Volt 0.315 Ohm |
Advanced Power Technology |
| 161 |
JX2N7228 |
POWER MOS IV JEDEC REGISTERED N - CHANNEL HIGH VOLTAGE POWER MOSFETS 500 Volt 0.415 Ohm |
Advanced Power Technology |
| 162 |
M08A |
8 Lead (0.150 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 163 |
M14A |
14 Lead (0.150 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 164 |
M14B |
14 Lead (0.300 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 165 |
M16A |
16 Lead (0.150 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 166 |
M16B |
16 Lead (0.300 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 167 |
M20B |
20 Lead (0.300 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 168 |
M24B |
24 Lead (0.300 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 169 |
M28B |
28 Lead (0.300 in. Wide) Molded Small Outline Package, JEDEC |
National Semiconductor |
| 170 |
MC14009 |
Uk�ad jednostki centralnej wsp�pracuj�cej z wy�wietlaczem LED |
Ultra CEMI |
| 171 |
MCY6880 |
8-bitowa r�wnoleg�a jednostka centralna (CPU) |
Ultra CEMI |
| 172 |
MCY7880 |
8-bitowa r�wnoleg�a jednostka centralna (CPU) |
Ultra CEMI |
| 173 |
MJ2955 |
Silicon PNP power transistor in Jedec TO-3 metal case |
SGS-ATES |
| 174 |
MKT-MXA28A |
MOLDED TSSOP JEDEC |
National Semiconductor |
| 175 |
MQA20 |
20 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 176 |
MQA24 |
24 Lead (0.150 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 177 |
MS48A |
48 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 178 |
MS56A |
56 Lead (0.300 in. Wide) Molded Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 179 |
MTC08 |
8-Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
| 180 |
MTC14 |
14 Lead Molded Thin Shrink Small Outline Package, JEDEC |
National Semiconductor |
| | | |
