| No. |
Part Name |
Description |
Manufacturer |
| 151 |
M14256 |
Memory Micromodules General Information for D1/ D2 and C Packaging |
ST Microelectronics |
| 152 |
M14C16 |
Memory Micromodules General Information for D1/ D2 and C Packaging |
ST Microelectronics |
| 153 |
M14C64 |
Memory Micromodules General Information for D1/ D2 and C Packaging |
ST Microelectronics |
| 154 |
MC500 MC400 SERIES |
MTTL I Integrated Circuits, functions and characteristics, logic diagram, packaging, cross reference |
Motorola |
| 155 |
MDTL MC930 MC830 SERIES |
General Information, functions and characteristics, packaging, truth tables, etc. |
Motorola |
| 156 |
MDTL MCE930 SERIES |
Dielectrically isolated integrated circuits, Radiation Hardness, DIONIC Structure, Nichrome Reistors, packaging, etc. |
Motorola |
| 157 |
MECL II |
MC1000/MC1200 series, functions and characteristics, logic diagrams, general information, packaging |
Motorola |
| 158 |
MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
| 159 |
MKI 1810 |
Box encapsulated capacitor for surface mounting , C-values 1000 pF-10 µF, 50 - 400 VDC, Code sizes 2220, 2824, 4036, 5045, 6560, Tape and Reel packaging |
Vishay |
| 160 |
MKT 1802 |
EIA standard chip sizes, Exellent thermal shock resistance, No piezoelectric effect, Nonpolar construction, Tape and Reel packaging supplied in hermetically sealed bags, Open construction |
Vishay |
| 161 |
MKT 1804 |
Box encapsulated capacitor for surface mounting , C-values 1000 pF-10 µF, 50 - 400 VDC, Code sizes 2220, 2824, 4036, 5045, 6560, Tape and Reel packaging |
Vishay |
| 162 |
MTTL II MC2100 MC2000 SERIES |
General Information, Logic Diagram, power dissipation, cross reference, packaging |
Motorola |
| 163 |
MTTL MC5400F MC7400F SERIES |
Functions and Characteristics, general information, logic diagram summary, packaging, definitions |
Motorola |
| 164 |
MTTL MC7400P MC5400L MC7400L SERIES |
Functions and Characteristics, logic diagram summary, general information, maximul ratings, noise imunity, packaging |
Motorola |
| 165 |
NTHS |
Surface Mount Chip NTC Thermistors, Wraparound Terminations, High-Density Monolithic Ceramic Construction, Available in 8 mm Tape and Reel Packaging |
Vishay |
| 166 |
PACKAGES |
A Complete presentation of CML's Package Styles (plus Despatch Packaging) in One PDF File Tape and Reel info updated |
CONSUMER MICROCIRCUITS LIMITED |
| 167 |
PACKAGES |
Packaging tubes, SIEMENS antistatic |
Siemens |
| 168 |
PACKAGING |
Packaging and Die Information |
Comlinear Corporation |
| 169 |
PACKAGING |
Packaging and Die Information |
Comlinear Corporation |
| 170 |
PC87309 |
SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging |
National Semiconductor |
| 171 |
PC87309-IBW/VLJ |
SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging |
National Semiconductor |
| 172 |
PC87309-IBW_EB |
SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging |
National Semiconductor |
| 173 |
PC87309-ICK/VLJ |
SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging |
National Semiconductor |
| 174 |
PC87309-ICK_EB |
SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging |
National Semiconductor |
| 175 |
PC87309VLJ |
PC87309 SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging |
National Semiconductor |
| 176 |
PCI2050 |
32-Bit, 33 MHz PCI-to-PCI Bridge, Compact PCI Hot-Swap Friendly, 9-Master, MicroStar Packaging |
Texas Instruments |
| 177 |
PCI2050GHK |
32-BIT, 33 MHZ PCI-TO-PCI BRIDGE, COMPACT PCI HOT-SWAP FRIENDLY, 9-MASTER, MICROSTAR PACKAGING |
Texas Instruments |
| 178 |
PCI2050PDV |
32-BIT, 33 MHZ PCI-TO-PCI BRIDGE, COMPACT PCI HOT-SWAP FRIENDLY, 9-MASTER, MICROSTAR PACKAGING |
Texas Instruments |
| 179 |
PO55-10LR-PC-Z |
High-density Packaging System(Coaxial Connectors for Hi-PAS Mounting) |
Hirose Electric |
| 180 |
PO55-14LR-PC |
High-density Packaging System(Coaxial Connectors for Hi-PAS Mounting) |
Hirose Electric |
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