No. |
Part Name |
Description |
Manufacturer |
151 |
AWT921 |
The AWT921 is a monolithic amplifier for use in communication systems that require high gain and output intercept point. |
Anadigics Inc |
152 |
BAV70 |
Microminiature high speed switching diode, code on case A4 |
mble |
153 |
BAV99 |
Microminiature High speed switching diode, code on case A7 |
mble |
154 |
BAW56 |
Microminiature High speed switching diode, code on case A1 |
mble |
155 |
BCW60 |
Microminiature High-Voltage low-frequency NPN transistor |
CCSIT-CE |
156 |
BFQ23C |
Silicon planar epitaxial gold-metallized PNP transistor in a sub-miniature HERMETICALLY SEALED micro-stripline envelope |
Philips |
157 |
BFS19 |
Microminiature High frequency NPN transistor |
CCSIT-CE |
158 |
BFS20 |
Microminiature High frequency NPN transistor |
CCSIT-CE |
159 |
BQ2028 |
4Kb EEPROM with single-wire HDQ interface and temperature sensor |
Texas Instruments |
160 |
BQ2028YZGR |
4Kb EEPROM with single-wire HDQ interface and temperature sensor 12-DSBGA -40 to 85 |
Texas Instruments |
161 |
BQ2028YZGT |
4Kb EEPROM with single-wire HDQ interface and temperature sensor 12-DSBGA -40 to 85 |
Texas Instruments |
162 |
BY614 |
Miniature high-voltage soft-recovery rectifier |
Philips |
163 |
CM-2H8 |
Miniature High Level Double Balanced Mixer 10-1000 MHz |
Sirenza Microdevices |
164 |
DS2435 |
Battery identification chip with time/temperature histogram |
Dallas Semiconductor |
165 |
DS2435 |
Battery Identification Chip with Time/Temperature Histogram |
MAXIM - Dallas Semiconductor |
166 |
DS2435S |
Battery identification chip with time/temperature histogram |
Dallas Semiconductor |
167 |
ECQV |
Designed for application where high density insertion of components is required. |
Panasonic |
168 |
ECQV1103JM |
Designed for application where high density insertion of components is required. |
Panasonic |
169 |
ECQV1104JM |
Designed for application where high density insertion of components is required. |
Panasonic |
170 |
ECQV1123JM |
Designed for application where high density insertion of components is required. |
Panasonic |
171 |
ECQV1124JM |
Designed for application where high density insertion of components is required. |
Panasonic |
172 |
ECQV1153JM |
Designed for application where high density insertion of components is required. |
Panasonic |
173 |
ECQV1154JM |
Designed for application where high density insertion of components is required. |
Panasonic |
174 |
ECQV1183JM |
Designed for application where high density insertion of components is required. |
Panasonic |
175 |
ECQV1184JM |
Designed for application where high density insertion of components is required. |
Panasonic |
176 |
ECQV1223JM |
Designed for application where high density insertion of components is required. |
Panasonic |
177 |
ECQV1224JM |
Designed for application where high density insertion of components is required. |
Panasonic |
178 |
ECQV1273JM |
Designed for application where high density insertion of components is required. |
Panasonic |
179 |
ECQV1274JM |
Designed for application where high density insertion of components is required. |
Panasonic |
180 |
ECQV1333JM |
Designed for application where high density insertion of components is required. |
Panasonic |
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