| No. |
Part Name |
Description |
Manufacturer |
| 151 |
5962-9174301MPA |
Clamping, Low Gain Op Amp with Fast 14-bit Settling |
National Semiconductor |
| 152 |
5962-9174301MPA |
Clamping, Low Gain Op Amp with Fast 14-bit Settling |
National Semiconductor |
| 153 |
5962-9203301MPA |
Low-Gain Op Amp with Fast 14-bit Settling |
National Semiconductor |
| 154 |
5962-9203301MPA |
Low-Gain Op Amp with Fast 14-bit Settling |
National Semiconductor |
| 155 |
5962-9955701Q2A |
12-Bit, 2.5 us Dual DAC, Serial Input, Programmable Settling Time, M temperature |
Texas Instruments |
| 156 |
5962-9955701QPA |
12-Bit, 2.5 us Dual DAC, Serial Input, Programmable Settling Time, M temperature |
Texas Instruments |
| 157 |
5962-9955702Q2A |
12-Bit, 2.5 us Dual DAC, Serial Input, Pgrmable Settling Time, Simultaneous Update, Low Power |
Texas Instruments |
| 158 |
5962-9955702QPA |
12-Bit, 2.5 us Dual DAC, Serial Input, Pgrmable Settling Time, Simultaneous Update, Low Power |
Texas Instruments |
| 159 |
5962-9957601Q2A |
12-Bit, 1 or 3.5 us DAC Serial Input, Dual DAC, Pgrmable Int. Ref., Settling Time, Pwr Consumption |
Texas Instruments |
| 160 |
5962-9957601QPA |
12-Bit, 1 or 3.5 us DAC Serial Input, Dual DAC, Pgrmable Int. Ref., Settling Time, Pwr Consumption |
Texas Instruments |
| 161 |
6-13B |
OUTLINE |
TOSHIBA |
| 162 |
6-14A |
OUTLINE |
TOSHIBA |
| 163 |
6-8A |
OUTLINE |
TOSHIBA |
| 164 |
6-8B |
OUTLINE |
TOSHIBA |
| 165 |
60PT2 |
CASE OUTLINES |
IPRS Baneasa |
| 166 |
6D24A-P |
24 PIN Outline drawing Package |
TOSHIBA |
| 167 |
6D28A-P |
28-PIN Outline drawing Package |
TOSHIBA |
| 168 |
6D42A-P |
42 PIN Outline Drawing Package |
TOSHIBA |
| 169 |
6N137 |
Small Outline, 5 Lead, High CMR, High Speed, Logic Gate Optocouplers |
Agilent (Hewlett-Packard) |
| 170 |
77-03 |
Outline dimensions package |
Motorola |
| 171 |
77-04 |
Outline dimensions package |
Motorola |
| 172 |
8 LEAD CERDIP (JA) |
Package Outlines |
Intersil |
| 173 |
8 LEAD PLASTIC (PA) |
Package Outlines |
Intersil |
| 174 |
8 LEAD SOIC (BA) |
Package Outlines |
Intersil |
| 175 |
8 LEAD TO3 METAL CAN (KA) |
Package Outlines |
Intersil |
| 176 |
80-02 |
Outline dimensions package |
Motorola |
| 177 |
8SOIC |
8 PIN SOIC PACKAGE OUTLINE |
SMSC Corporation |
| 178 |
A371 |
A371-Type Analog Uncooled Isolated DFB FastLight �� Laser Module |
Agere Systems |
| 179 |
A371-20AS |
A371-Type Analog Uncooled Isolated DFB FastLight �� Laser Module |
Agere Systems |
| 180 |
A371-20BS |
A371-Type Analog Uncooled Isolated DFB FastLight �� Laser Module |
Agere Systems |
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