No. |
Part Name |
Description |
Manufacturer |
15511 |
CY7C346-35RI |
USE ULTRA37000TM FOR ALL NEW DESIGNS(128-Macrocell MAX EPLD) |
Cypress |
15512 |
CY7C346-35RMB |
USE ULTRA37000TM FOR ALL NEW DESIGNS(128-Macrocell MAX EPLD) |
Cypress |
15513 |
CY7C4255V |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15514 |
CY7C4255V-10ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15515 |
CY7C4255V-15ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15516 |
CY7C4255V-25ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15517 |
CY7C4265V |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15518 |
CY7C4265V-10ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15519 |
CY7C4265V-15ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15520 |
CY7C4275V |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15521 |
CY7C4275V-10ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15522 |
CY7C4275V-15ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15523 |
CY7C4285V |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15524 |
CY7C4285V-10ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15525 |
CY7C4285V-15ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15526 |
CY7C4285V-25ASC |
3.3V operation for low power consumption and easy integration into low-voltage systems |
Cypress |
15527 |
CYW256OXC |
12 Output Buffer for 2 DDR and 3 SRAM DIMMS |
Cypress |
15528 |
CYW256OXCT |
12 Output Buffer for 2 DDR and 3 SRAM DIMMS |
Cypress |
15529 |
CYW305OXC |
Frequency Controller with System Recovery for Intel® Integrated Core Logic |
Cypress |
15530 |
CYW305OXCT |
Frequency Controller with System Recovery for Intel Integrated Core Logic |
Cypress |
15531 |
CZA04S CZA06S |
Surface Mount Chip Attenuator, Tolerance matching and temperature tracking superior to individual components, Maximum input power: 75 milliwatts for CZA06S; 40 milliwatts for CZA04S, Frequency range: DC to 3GHz |
Vishay |
15532 |
CZA04S CZA06S |
Surface Mount Chip Attenuator, Tolerance matching and temperature tracking superior to individual components, Maximum input power: 75 milliwatts for CZA06S; 40 milliwatts for CZA04S, Frequency range: DC to 3GHz |
Vishay |
15533 |
D...-CRCW |
Metal Glaze on High Quality Ceramic, Protective Over Glaze, SnPb Contacts on Ni Barrier Layer, Excellent Stability at Different Environmental Conditions, Suitable for Commercial and Special Applications |
Vishay |
15534 |
D..CRCW....LR |
Thick Film, Rectangular, Low Value Resistors, Special metal glaze on high quality ceramic, Protective overglaze, SnPb contacts on Ni barrier layer, Suitable for current sensors and shunts |
Vishay |
15535 |
D..HR/CRCW . . . |
Rarefied Metal Glaze on High Quality Ceramic, Protective Over Glaze Passivation, SnPb Contacts on Ni Barrier Layer, Silver Palladium Contacts for Conductive Adhesive Attachment on Request, Suitable for Voltage Dividers and Hybrids |
Vishay |
15536 |
D..HR/CRCW . . . |
Rarefied Metal Glaze on High Quality Ceramic, Protective Over Glaze Passivation, SnPb Contacts on Ni Barrier Layer, Silver Palladium Contacts for Conductive Adhesive Attachment on Request, Suitable for Voltage Dividers and Hybrids |
Vishay |
15537 |
D05022-152HC |
N-Channel FET Synchronous Buck Regulator Controller for Low Output Voltages |
National Semiconductor |
15538 |
D10 |
Memory Micromodules General Information for D1, D2 and C Packaging |
SGS Thomson Microelectronics |
15539 |
D10 |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
ST Microelectronics |
15540 |
D10-MICROMODULES |
MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING |
SGS Thomson Microelectronics |
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