No. |
Part Name |
Description |
Manufacturer |
16171 |
UPA832TF-T1 |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A 6-PIN THIN-TYPE SMALL MINI MOLD PACKAGE |
NEC |
16172 |
UPA833TF |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A 6-PIN THIN-TYPE SMALL MINI MOLD PACKAGE |
NEC |
16173 |
UPA833TF-T1 |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A 6-PIN THIN-TYPE SMALL MINI MOLD PACKAGE |
NEC |
16174 |
UPA834TF |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A 6-PIN THIN-TYPE SMALL MINI MOLD PACKAGE |
NEC |
16175 |
UPA834TF-T1 |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A 6-PIN THIN-TYPE SMALL MINI MOLD PACKAGE |
NEC |
16176 |
UPA835 |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A FLAT-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD PACKAGE |
NEC |
16177 |
UPA835TC |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A FLAT-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD PACKAGE |
NEC |
16178 |
UPA835TC-T1 |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A FLAT-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD PACKAGE |
NEC |
16179 |
UPA836 |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A 6-PIN THIN-TYPE SMALL MINI MOLD PACKAGE |
NEC |
16180 |
UPA836TF |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A 6-PIN THIN-TYPE SMALL MINI MOLD PACKAGE |
NEC |
16181 |
UPA836TF-T1 |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A 6-PIN THIN-TYPE SMALL MINI MOLD PACKAGE |
NEC |
16182 |
UPA840 |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A FLAT-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD PACKAGE |
NEC |
16183 |
UPA840TC |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A FLAT-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD PACKAGE |
NEC |
16184 |
UPA840TC-T1 |
NPN SILICON EPITAXIAL TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A FLAT-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD PACKAGE |
NEC |
16185 |
UPA843TC |
NPN SILICON RF TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A FLAT-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD |
NEC |
16186 |
UPA843TC-T1 |
NPN SILICON RF TRANSISTOR WITH 2 DIFFERENT ELEMENTS IN A FLAT-LEAD 6-PIN THIN-TYPE ULTRA SUPER MINIMOLD |
NEC |
16187 |
UPA880TS |
NPN SiGe RF TRANSISTOR (WITH 2 DIFFERENT ELEMENTS) IN A 6-PIN SUPER LEAD-LESS MINIMOLD (1007 PACKAGE) |
NEC |
16188 |
UPA880TS-T3 |
NPN SiGe RF TRANSISTOR (WITH 2 DIFFERENT ELEMENTS) IN A 6-PIN SUPER LEAD-LESS MINIMOLD (1007 PACKAGE) |
NEC |
16189 |
UPA901TU |
NPN SiGe RF IC IN A 8-PIN LEAD-LESS MINIMOLD |
NEC |
16190 |
UPA901TU-A |
NPN SiGe RF IC IN A 8-PIN LEAD-LESS MINIMOLD |
NEC |
16191 |
UPA901TU-T3 |
NPN SiGe RF IC IN A 8-PIN LEAD-LESS MINIMOLD |
NEC |
16192 |
UPA901TU-T3-A |
NPN SiGe RF IC IN A 8-PIN LEAD-LESS MINIMOLD |
NEC |
16193 |
Z2801R5S |
Hi-Rel DC-DC Rad-Hard Single Converter in a Z package with 1.5 Vout |
International Rectifier |
16194 |
Z2802R5S |
Hi-Rel DC-DC Rad-Hard Single Converter in a Z package with 2.5 Vout |
International Rectifier |
16195 |
Z280343S |
Hi-Rel DC-DC Rad-Hard Single Converter in a Z package with 3.3 Vout |
International Rectifier |
16196 |
Z2803R3S |
Hi-Rel DC-DC Rad-Hard Single Converter in a Z package with 3.3 Vout |
International Rectifier |
16197 |
ZT83 |
Bipolar NPN Device in a Hermetically sealed TO18 Metal Package. |
SemeLAB |
16198 |
ZT92 |
Bipolar NPN Device in a Hermetically sealed TO39 Metal Package |
SemeLAB |
16199 |
ZTX653DCSM |
NPN DUAL TRANSISTOR IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS |
SemeLAB |
16200 |
ZTX753DCSM |
PNP DUAL TRANSISTOR IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS |
SemeLAB |
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