| No. |
Part Name |
Description |
Manufacturer |
| 1651 |
UT7Q512K-UPA |
512K x 8 SRAM. 100ns access time, 5V operation. Prototype flow. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1652 |
UT8Q512-20ICA |
512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow. |
Aeroflex Circuit Technology |
| 1653 |
UT8Q512-20UCA |
512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow. |
Aeroflex Circuit Technology |
| 1654 |
UT8Q512-20UWA |
512K x 8 SRAM. 20ns access time, 3.3V operation. Lead finish hot solder dipped. Extended industrial temperature range flow. |
Aeroflex Circuit Technology |
| 1655 |
UT8Q512-ICA |
512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow. |
Aeroflex Circuit Technology |
| 1656 |
UT8Q512-UCA |
512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish hot solder dipped. Military temperature range flow. |
Aeroflex Circuit Technology |
| 1657 |
UT8Q512-UWA |
512K x 8 SRAM. 25ns access time, 3.3V operation. Lead finish hot solder dipped. Extended industrial temperature range flow. |
Aeroflex Circuit Technology |
| 1658 |
UT8R128K32-15WCA |
128K x 32 SRAM. 15ns access time. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1659 |
UT8R128K32-15WWA |
128K x 32 SRAM. 15ns access time. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1660 |
UT8R256K1615TBDCA |
256K x 16 SRAM. 15ns access time. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1661 |
UT8R512K8-15UCA |
512K x 18 SRAM. 15ns access time. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1662 |
UT8R512K8-15UWA |
512K x 18 SRAM. 15ns access time. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1663 |
UT9Q512-20ICA |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1664 |
UT9Q512-20IWA |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1665 |
UT9Q512-20UCA |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1666 |
UT9Q512-20UWA |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1667 |
UT9Q512-ICA |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1668 |
UT9Q512-IWA |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1669 |
UT9Q512-UCA |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1670 |
UT9Q512-UWA |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1671 |
VE13 |
Epoxy Dipped Zinc Oxide Varistors |
SGS Thomson Microelectronics |
| 1672 |
VMO580-02F |
HipPerFETTM Module |
IXYS Corporation |
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