| No. |
Part Name |
Description |
Manufacturer |
| 1801 |
ULLC0402FC3.3C |
3.3V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards |
Protek Devices |
| 1802 |
UT8Q512K32 |
16Megabit SRAM MCM |
Aeroflex Circuit Technology |
| 1803 |
UT8Q512K32-SPC |
16Megabit SRAM MCM |
Aeroflex Circuit Technology |
| 1804 |
UT8Q512K32-SWC |
16Megabit SRAM MCM |
Aeroflex Circuit Technology |
| 1805 |
UT9Q512-20ICA |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1806 |
UT9Q512-20ICC |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. |
Aeroflex Circuit Technology |
| 1807 |
UT9Q512-20ICX |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish factory option. |
Aeroflex Circuit Technology |
| 1808 |
UT9Q512-20IPC |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. Prototype flow. |
Aeroflex Circuit Technology |
| 1809 |
UT9Q512-20IWA |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1810 |
UT9Q512-20IWC |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. |
Aeroflex Circuit Technology |
| 1811 |
UT9Q512-20IWX |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish factory option. |
Aeroflex Circuit Technology |
| 1812 |
UT9Q512-20UCA |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1813 |
UT9Q512-20UCC |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. |
Aeroflex Circuit Technology |
| 1814 |
UT9Q512-20UCX |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish factory option. |
Aeroflex Circuit Technology |
| 1815 |
UT9Q512-20UPC |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. Prototype flow. |
Aeroflex Circuit Technology |
| 1816 |
UT9Q512-20UWA |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1817 |
UT9Q512-20UWC |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. |
Aeroflex Circuit Technology |
| 1818 |
UT9Q512-20UWX |
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish factory option. |
Aeroflex Circuit Technology |
| 1819 |
UT9Q512-ICA |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1820 |
UT9Q512-ICC |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. |
Aeroflex Circuit Technology |
| 1821 |
UT9Q512-ICX |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish factory option. |
Aeroflex Circuit Technology |
| 1822 |
UT9Q512-IPC |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow. |
Aeroflex Circuit Technology |
| 1823 |
UT9Q512-IWA |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1824 |
UT9Q512-IWC |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. |
Aeroflex Circuit Technology |
| 1825 |
UT9Q512-IWX |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish factory option. |
Aeroflex Circuit Technology |
| 1826 |
UT9Q512-UCA |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
| 1827 |
UT9Q512-UCC |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. |
Aeroflex Circuit Technology |
| 1828 |
UT9Q512-UCX |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish factory option. |
Aeroflex Circuit Technology |
| 1829 |
UT9Q512-UPC |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow. |
Aeroflex Circuit Technology |
| 1830 |
UT9Q512-UWA |
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. |
Aeroflex Circuit Technology |
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